Latest News & Updates

PCB Design and Manufacturing

PCBMASTER Helps You Understand What the Thermal Expansion Coefficient of a PCB Board Is and How to Measure It

I. Why Does a PCB Board "Deform" When Heated? Inspiration from a Beer Bottle CapWhen you open an iced beer, have you ever noticed the property of the metal bottle cap shrinking when it gets cold? The materials in a PCB board also exhibit th...

Mar 4, 2025 Read More

Types of PCBs

PCBMASTER Decodes PCBA Processing Terminology Unlocking the Knowledge Treasure of Electronics Manufacturing

In the field of electronics manufacturing, PCBA processing is a critical stage involving numerous technical terms. A deep understanding of these terms not only enhances communication among professionals and ensures precise control over prod...

Mar 4, 2025 Read More

PCB Design and Manufacturing

PCBMASTER Reveals : Avoid These Design Traps to Create High - Reliability PCB and PCBA Products

In the global electronics manufacturing industry, the reliability of PCBs (Printed Circuit Boards) and PCBA (Printed Circuit Board Assembly) directly affects the lifespan and performance of end - products. However, industry data shows that ...

Mar 4, 2025 Read More

PCB Materials

PCBMASTER’s 2024 High-Frequency PCB Material Selection Guide In-Depth Analysis of Top 5 Manufacturers’ Core Technologies and Market Performance

Amid accelerating global 5G base station deployment (annual growth rate of 17.2%) and surging satellite communication demands (market size reaching $68.9 billion in 2023), the high-frequency PCB material market is undergoing transformative ...

Mar 4, 2025 Read More

PCB Design and Manufacturing

PCBMASTER shares with you how to prevent signal integrity issues in high - frequency PCB design.

In 5G communication and millimeter - wave radar applications, out - of - control signal integrity (SI) of high - frequency PCBs can directly lead to system failures. Engineers often face three major challenges: signal reflection, crosstalk,...

Mar 3, 2025 Read More

PCB Design and Manufacturing

PCBMASTER will guide you to understand how to achieve a soldering yield rate of 99.99% in PCBA assembly.

Full-Process Optimization Solution1. The Microscopic Battle of Solder Paste Printing ① Stencil Opening Strategy:→ For 0.3mm pitch BGA, use trapezoidal openings (upper width 0.28mm / lower width 0.32mm), which can increase the solder paste...

Mar 3, 2025 Read More

PCB Design and Manufacturing

PCBMASTER shares with you the practical design of flexible-rigid printed circuit boards in medical devices!

Industry Demand Case Study:Implantable devices like pacemakers require PCBs to withstand >500,000 bends over 10 years with a thickness ≤0.4mm. Traditional designs showed a 23% failure rate, making rigid-flex PCBs the breakthrough solution....

Mar 3, 2025 Read More

PCB Design and Manufacturing

PCBMASTER shares with you ----Thermal Management of High-Power PCBs From Material Selection to Structural Design

Failure analysis of an IGBT module used in a new energy vehicle shows that 80% of the failures are caused by solder joint fatigue due to thermal cycling. When the local temperature rise of the PCB exceeds 85°C, the device life is reduced by...

Mar 3, 2025 Read More

PCB Design and Manufacturing

Explore with PCBMASTER --- In high - speed PCB design, how to address the eye diagram collapse of signals above 10Gbps

1. The Golden Rules of Stack - Up Design① Material SelectionWhen the signal rate is ≥10Gbps, ultra - low - loss materials (such as Megtron6 with Df = 0.002) should be preferred. In a certain optical module case, after replacing FR - 4, th...

Mar 3, 2025 Read More

PCB Materials

Let's Explore with PCBMASTER The Revolution of Biodegradable PCB Substrates - Technical Routes and Industrialization Practices for PLAPHA Composite Materials with a Tg Value Exceeding 120°C

I. Performance Bottlenecks of Bio-Based Materials vs. Industrial DemandsTraditional biodegradable polymers (e.g., PLA) exhibit glass transition temperatures (Tg) below 80°C and heat deflection temperatures (HDT) under 100°C, failing to meet...

Mar 1, 2025 Read More

PCB Design and Manufacturing

PCBMASTER Presents - In - depth Analysis of the Impact of High - Difficulty PCB Lamination Time on Product Quality and Optimization Strategies

Ⅰ.Core Mechanism of Lamination Time Impact on High-Difficulty PCB Quality1. Resin Flow and Impregnation Control①Short Lamination Time (<15% of standard duration):Insufficient resin flow results in inner copper foil surface roughness >3.5 ...

Mar 1, 2025 Read More

PCB Design and Manufacturing

PCBMASTER Presents Top 10 Common Errors in PCB Silkscreen Design and Professional Solutions

Author: Jack Wang1. Insufficient Pad Clearance (Critical Safe Zone Violation)Error Description: Silkscreen character edges are placed <0.15mm (6mil) from pads.Risk Analysis:Solder mask misalignment may cause solder bridging (incidence rate ...

Mar 1, 2025 Read More