PCB specification parameters
X mm
pcs
Advanced

Process Options

HASL with lead
HASL lead free
Immersion gold(ENIG)
OSP
No surface
Immersion tin
Immersion silver(Ag)
Immersion Nickel-plated gold
Hard gold

Advanced Options

HDI-Buried/blind vias
Customer stackup
RF Material+FR-4 mixed stackup
Impedance control
Half-cut/Castellated Holes
Edge Plating
Gold finger
Drill-step Deep Control
Back drill deep contral
Buried and embedded copper block
Buried resistance-capacitance
Print serial number
Peelable soldermask
Thermoelectric heat dissipation
Insulation for plug-in components
Copper-Aluminum mixed
Aluminum-based superconductors
Copper-based superconductors
Via filled with resin
Via filled with copper paste
Plated Via plugging
Via in pad
Circuit rework unacceptable
Hole copper thickness≧25UM
Countersinks/Counterbores
Gold Plating for Leadless PCB
Precision routing±0.05mm
Confirm work file

Customized Options

PCB Assembly Service

The above - mentioned PCBs require PCB assembly

PCB Build Time
PCB Fee
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