Author: Jack WangDriven by 5G communications, millimeter-wave radar, and high-speed data transmission, high-frequency FPC (Flexible Printed Circuit) has become an indispensable neural pathway for cutting-edge electronic equipment. Unlike tr...
Author: Jack WangHigh Frequency Flexible Printed Circuits (High Frequency FPC) have become essential components in cutting-edge fields such as 5G communications, millimeter-wave radar, and high-speed data interconnects. However, high-freque...
Author: Jack WangIn today’s electronics industry pursuing extreme thinness and high-density integration, HDI FPC (High-Density Interconnect Flexible Printed Circuit) has become the core enabler for premium electronic devices. This article ...
Author: Jack WangIn the field of Flexible Printed Circuits (FPCs), long-length FPCs typically refer to highly challenging products exceeding 1 meter, even reaching several meters in length. Demand for such devices is surging in applications...
Author: Jack WangI. Core Challenges and Technological Breakthroughs in Multilayer FPC1.Multilayer FPC (4+ layers) achieves 10× higher wiring density than single-sided boards but faces three critical challenges:2.Layer Misalignment: ±25μm re...
Author: Jack WangIn Flexible Printed Circuit (FPC) technology, single-sided FPC is widely used in consumer electronics, medical devices, and automotive sensors due to its simple structure and cost-effectiveness. This article explores critic...
Author: Jack WangDriven by 5G communications, millimeter-wave radar, and high-speed data transmission, high-frequency FPC (Flexible Printed Circuit) has become an indispensable neural pathway for cutting-edge electronic equipment. Unlike tr...
Author: Jack WangWith the growing adoption of wearable medical devices and new energy vehicle BMS systems, demand for ultra-long FPCs (exceeding 1.2 meters in length) has surged. This article provides an in-depth analysis of the critical pe...
Author: Jack WangI. Core Technical Characteristics of PolyimideAs the core substrate material for flexible printed circuits (FPCs), polyimide (PI) films hold over 80% of the market share (per Prismark 2023 data). Their unique properties ori...
Author: Jack WangI. Core Value and Industry Status of PCBA DesignPCBA (Printed Circuit Board Assembly) design is the core stage of electronic product development, directly impacting product performance, reliability, and production costs. Ac...
Author: Jack WangI. Why Are Rigid-Flex PCBs Revolutionizing Electronic Product Architectures?According to Prismark's 2024 report, the global rigid-flex PCB market has reached $7.8 billion and is expected to exceed $12 billion by 2028, with ...