High-Speed PCB

High-Speed PCB refers to PCBs where the physical properties (e.g., impedance, loss) of the PCB become the dominant factors affecting signal quality when the rise/fall time of digital signals is very short (usually less than 6 times the signal propagation delay).

Your product may need High-Speed PCB if it involves: high-bandwidth data communication (e.g., 5G base stations, data center servers, 400G optical modules), high-frequency clocks (e.g., processors >100MHz, FPGAs, DDR memory interfaces), high-speed serial buses (e.g., PCIe, SAS, SATA, USB 3.0+), automotive ADAS systems, high-end test and measurement equipment, etc.

1. Complete stack-up requirements: including material, thickness, and copper thickness of each layer;

2. Impedance control requirements: line width, spacing, target impedance value and tolerance (e.g., 50Ω±10%, 100Ω±5% differential) for all impedance-controlled lines;

3. Material requirements: if a specific brand and model (e.g., TaiYao, Panasonic Megtron) is specified, please mark it clearly; if you have no material selection experience, you can provide the product's operating frequency, and our professional engineers will select and match materials for you;

4. Key network identification: mark clocks, differential pairs, sensitive signal lines, etc. in Gerber or design files.

Yes, the PCBMASTER team provides free value-added services.

You can send your circuit block diagram, key components, and performance requirements to us, and our engineer team will recommend the optimal stack-up structure and material selection plan for you, and use professional software for impedance calculation and simulation to ensure the design is manufacturable from the source.

PCBMASTER implements full-process quality control, including:

• Electrical testing: 100% flying probe or test fixture continuity testing;
• Physical testing: Automated Optical Inspection (AOI), impedance TDR testing, cross-sectional metallographic microscope analysis;
• Reliability testing: can provide reports such as thermal stress testing and solderability testing.

We promise that every delivered board complies with your technical specifications and industry standards.

For high-speed boards with conventional layers (8-16 layers) and materials, the standard lead time is approximately 2-3 weeks; if the design is complex (e.g., more than 20 layers, hybrid lamination, a large number of back drills), the lead time may be appropriately extended. We also provide expedited production services to meet your urgent project needs.

You can start with just three steps:

• Contact us: through the website, phone or email, an exclusive account manager will serve you;
• Provide materials: send Gerber files, stack-up requirements and impedance control table;
• Obtain plan and quotation: the engineer team conducts DFM (Design for Manufacturability) analysis and provides optimization suggestions, then gives a formal quotation.