Aerospace / Medical-Grade

Flexible PCBs Manufacturer

PCBMASTER specializes in high-performance flexible printed circuits for demanding applications

100+

Complex Projects Completed
99.9%

Customer Satisfaction Rate
50+

Patented Technologies
98.6%

On-time Delivery Rate

PCBMASTER Flexible PCBs Advantages

1 Ultra flexibility and softness

Specialized Bend-Resistant Flexible Materials for Diverse Flexing Applications

Manufactured with internationally renowned materials from DuPont, Panasonic, Shengyi, I-tec, Taiwan Union, etc., combined with high-standard manufacturing processes. Ensures ultra-high flexibility while guaranteeing product service life and reliability. FPC products can withstand over 100 million folding cycles

2 Ultra-thin and ultra-light

Self-Developed Custom Ultra-Thin Materials | Double-Sided + Coverlay Thickness as Low as 0.08mm

PCBMASTER independently researches and fabricates special FPC materials based on clients' design requirements. The minimum finished thickness of FPC can reach 0.08mm, meeting clients' personalized special needs.

3 Ultra-high precision manufacturing

PCBMASTER's Ultra-High Precision FPC Manufacturing Capabilities

Leveraging extensive FPC manufacturing experience, PCBMASTER pushes FPC manufacturing precision to the extreme. Current production limits for FPC achieve: Min line width/spacing of 0.05mm, line width tolerance of ±10% and outline tolerance of ±0.05mm。

4 Technical Support

PCBMASTER Provides Professional Technical Support to Help Clients Identify Design Flaws

With full-process technical support from our professional engineering team, we offer design file optimization, cost-effective material selection, stackup optimization and precise DFM analysis – proactively identifying design flaws to avoid wasting clients' time and economic costs.

5 Cost Reduction at Engineering Design Stage

PCBMASTER Proactively Provides Cost Optimization Suggestions

PCBMASTER engineers analyze your designs and manufacturing costs, then tailor optimizations (design, materials, stackup) and DFM analysis to your product's needs. This proactive approach cuts costs at the source while enhancing quality, performance and value.

The Products We Make

Customized FPCs, your own circuit solution.

Ultra-thin double-sided 0.08mm

0.08mm Thickness Immersion gold

Track/Spacing: 0.075/0.075mm
Material: PI Polyimide Adhesive-Free Rolled Substrate
Special technology: Ultra-Thin Double-Sided + Coverlay.Finsih thick ness 0.08mm

4Layer FPC

0.18mm Thickness Gold finger

Track/Spacing: 0.065/0.06mm
Material: DuPont PI Polyimide Adhesive-Free Rolled Substrate
Special technology: Soft Ink, Electromagnetic Shielding Film, FR-4 Stiffener, PI Stiffener

PI Transparent Material FPC

0.10mm Thickness Immersion gold

Track/Spacing: 0.10/0.10mm
Material: PI Polyimide Transparent High-Temperature Resistant Material
Special technology: PI High-Temperature Resistant Material, Ultra-Thin Custom Transparent Material

6Layer Inductor Coil FPC

0.28mm Thickness Immersion gold

Track/Spacing: 0.075/0.10mm
Material: Panasonic PI Polyimide Adhesive-Free Rolled Substrate
Special technology: Panasonic Imported Materials, High-Precision and High-Alignment Coil

FPC Prototype

Special Offer

QTY: 5pcs
Layer: 1 or 2 layer
Surface finish: Immersion gold 1u"
Size: ≤100*100mm
FPC thickness: 0.1 or 0.11mm
Board type: Single piece

$ 5.00 usd

FPC+FPC Assembly

Free Stencil

QTY: 5PCS
Layer: 1 or 2 layer
Size: ≤100*100mm
Types of components: ≤40
Total components: ≤400
SMD stencil: Free

$ 40.00 usd

Advanced Flexible Circuit Solutions

Professional R&D and manufacturing team, 20 Years of PCB experience, Dive into a world of innovative PCB possibilities

Research Institute of a University

Rigid-Flex Project

90%

Cost Reduction

40 days

Project Duration

100%

Design Compliance

50%

Weight Reduction

Transforming an 8-layer rigid-flex design into a cost-effective 4-layer FPC solution for industrial control sensors

Background

Design Review

Comprehensive analysis of your DXF design files and requirements
Feasibility Assessment

Evaluation of manufacturing feasibility and potential risks
Optimization Proposal

Tailored design optimization proposal with cost projections
Validation & Delivery

Prototype manufacturing, testing and final solution delivery

Technical Specifications

Layers	4-layer pure FPC with PI reinforcement
Finished Thickness	0.23mm
PI Reinforcement	0.20mm thickness
Copper Thickness	0.5oz base, 25-35μm finished
Substrate	Rolled annealed copper
Surface Finish	Immersion gold

Project Background

Back

Research Institute of a University approached us with a complex 8-layer rigid-flex board design for an industrial control sensor, seeking manufacturing feasibility and cost optimization.

Design Features

Central rigid board area with surrounding flexible layers
Chip placement in both rigid and flexible zones (3.5mm×3.5mm)
Complex layer stackup with tight spacing requirements

Technical Questions

Does the design spacing meet rigid-flex minimum requirements?
What are the process risks of placing 3.5mm×3.5mm chips in both zones?
Recommended reliability measures for rigid-flex junctions?
Are critical design adjustments needed for manufacturability?
Potential manufacturing or reliability risks to be addressed?

"The optimized 4-layer FPC solution not only met all original design requirements but also achieved an impressive 90% cost reduction. The project was completed within 40 days, far exceeding our expectations."

— Project Manager, University of Hong Kong

5G mmWave Radar FPC

High-frequency solution for automotive 77GHz radar

0.42dB

Insertion Loss @77GHz

1.8°

Phase Deviation

0.42dB/cm insertion loss beats industry standard by 30%

— Automotive Electronics Engineer

Challenge

Design antenna FPC for 77GHz radar with:

50Ω±10% characteristic impedance at 10GHz
≤0.5dB/cm insertion loss at 77GHz
≤2° phase error at 5mm bend radius

Solution

Rogers RO3003® laminate (Dk=3.0, Df=0.0013)
3-layer stackup with microstrip and ground planes
HDI technology for ±5μm trace tolerance

Implantable Cardiac Monitor

ISO 13485 certified solution for pacemaker interconnects

1.2×10⁹

Insulation Resistance (Ω)

98%

Cell Viability Rate

18 months of faultless operation in animal trials, 92% defect rate reduction vs original supplier

— R&D Director, Global Medical Device Leader

Challenge

Develop ultra-thin FPC for pacemakers with:

≤0.1mm thickness for dynamic heart movement
10⁹Ω insulation after 134°C autoclave sterilization
Zero biocompatibility failures in cytotoxicity tests

Solution

DuPont Kapton® PI-HS substrate (50μm) with halogen-free adhesive
9μm RA copper foil with 1μm gold plating for oxidation resistance
Laser drilling (50μm) and LPI coverlay for seamless encapsulation

Satellite Antenna Foldable FPC

LEO satellite solution for extreme space environments

0.3dB

Signal Loss Increase

28K+

Thermal Cycles Survived

2+ years of satellite operation, far exceeding NASA-STD-8739.8 requirements

— Project Engineer, Aerospace Group

Challenge

Design foldable FPC for LEO satellites with:

-196°C to +125°C operating temperature range
≥1×10⁵ Gy radiation tolerance (gamma rays)
≤1.5dB signal loss at 5GHz after 1M folds

Solution

Asahi Kasei AP850 fluorinated PI substrate (1×10⁶ Gy tolerance)
5μm Parylene C coating for radiation shielding
Ω serpentine routing with 30% length redundancy

Flexible Printed Circuit (FPC) Capabilities

Comprehensive technical specifications for flexible printed circuits from 2025 to 2027

Type		2025	2026	2027	Remark
Materials	Flexible substrate	Non-adhesive substrate, Adhesive substrate, LCP	Non-adhesive substrate, Adhesive substrate, LCP	Non-adhesive substrate, Adhesive substrate, LCP	/
	Stiffener	PI, FR4, steel, Aluminium	PI, FR4, steel, Aluminium	PI, FR4, steel, Aluminium	/
	Adhesive Sheet	Epoxy glue, acrylic glue	Epoxy glue, acrylic glue	Epoxy glue, acrylic glue	/
	Covering film	Epoxy glue, acrylic glue	Epoxy glue, acrylic glue	Epoxy glue, acrylic glue	Acrylic adhesive is the main type.
Layer	Flexible	12	14	16	/
Thickness	Finished	Min 0.03mm	Min 0.03mm	Min 0.03mm	single side FPC
Thickness	Tolerance	Min ±0.015mm	Min ±0.015mm	Min ±0.015mm	/
Finished copper	Inner copper	1/3 - 2oZ	1/4 - 2oZ	1/4 - 2oZ	Base copper thickness
Finished copper	outer copper	1/3 - 2oZ	1/4 - 3oZ	1/4 - 3oZ	Base copper thickness
Size	Max Size	Min 2mm*10mm	Min 2mm*10mm	Min 2mm*5mm	/
Size	Min Size	Max 500mm*610mm	Max 500mm*610mm	Max 500mm*610mm	/
Track/Spacing	Inner Layer	2mil/2mil	2mil/2mil	1.8mil/1.8mil	Finished Copper 0.5oZ
Track/Spacing	Out Layer	2mil/2mil	2mil/2mil	1.8mil/1.8mil	Finished Copper 1oZ
Finish hole size	CNC hole size	Min 0.1mm	Min 0.1mm	Min 0.1mm	/
Finish hole size	Laser hole size	Min 0.075mm	Min 0.075mm	Min 0.05mm	/
Thickness to diameter	CNC Drilling	Max 1:1	Max 1:1	Max 1:1	/
Thickness to diameter	Laser drilling	Max 12:1	Max 15:1	Max 15:1	/
Dielectric thickness	flexible core	Min 0.0125mm	Min 0.0125mm	Min 0.0125mm	/
Dimensional tolerance	Laser cutting	±0.05mm	±0.05mm	±0.05mm	UV laser cutting
Dimensional tolerance	Die cutting	Min 0.05mm	Min 0.05mm	Min 0.05mm	Slow wire cutting steel die

Core Capabilities

Max Layers (2027): 16
Min Thickness: 0.03mm
Substrate Type: Non-adhesive/Adhesive/LCP
Stiffener Material: PI/FR4/Steel/Aluminium

Precision & Size

Track/Spacing (2027): 1.8mil/1.8mil
Min CNC Hole: 0.1mm
Min Laser Hole (2027): 0.05mm
Max Size: 500mm×610mm

Order Type	Size	Standard Lead Time	Expedited Service
Prototypes	≤3 ㎡	5 - 6 days	Expedited shipment available in 1 - 2 days
Small Batch	3 - 10 ㎡	8 - 9 days	Expedited shipment available in 5 - 6 days
Mass Production	≥10 ㎡	9 - 11 days	Expedited shipment available in 7 - 8 days

150 +

Manufacturing Engineer

20,000㎡ +

Monthly Production Capacity

Full Technical Specifications

Type		2025	2026	2027	Remark
Materials	Flexible substrate	Non-adhesive/Adhesive/LCP	Non-adhesive/Adhesive/LCP	Non-adhesive/Adhesive/LCP	/
Materials	Stiffener	PI/FR4/Steel/Aluminium	PI/FR4/Steel/Aluminium	PI/FR4/Steel/Aluminium	/
Key Params	Layers	12	14	16	/
Key Params	Track/Spacing	2mil/2mil	2mil/2mil	1.8mil/1.8mil	0.5-1oZ Copper
Hole Size	CNC	0.1mm	0.1mm	0.1mm	/
Hole Size	Laser	0.075mm	0.075mm	0.05mm	/

Manufacturing Process Flow

1. Cutting Material

2. Drilling

3. Copper Plating/Electroplating

4. Circuit/ETCH

5. Stackup

6. Immersion Gold

7. Silkscreen

8. AOI & Final Test

9. Routing and Die Cut

Quality Certification System

We manufacture 100% of our products in accordance with international quality certificates.

IATF 16949

ISO 13485

ISO 9001

ISO 14001

ISO 45001

FAQs of Flexible PCB

Below are the FPC Frequently Asked Questions, if you have any other questions, please feel free to contact us.

①Typical FPC: 50μm/50μm (2mil). High-precision FPC: 25μm/25μm (1mil). 
② Key factors: Material thickness, manufacturing process (laser etching enables finer lines) and reliability under bending (thinner lines are more fragile).

Test: 
	Bend tester simulates flexing, records cycles to open circuit/abnormal resistance. 
Standards: 
	IPC-6013D defines conditions; 
	consumer electronics require ≤10% resistance change after 100k cycles. 
Lifespan: 
	100k–500k cycles (standard), >1M cycles (auto/aero).

1.Interlayer alignment: ≤50μm offset control to prevent shorts. 
2.Stress relief: Gradient traces in bends to reduce stress. 
3.Blind/buried vias: Laser drilling for high-density routing. 
4.Material CTE matching: Avoid delamination in bending.

1.Issues: 
	Pad lifting due to heat - induced substrate deformation. 
	Cold solder joints from poor FPC positioning. 
	PI substrate carbonization in high - temp soldering. 
2.Solutions: 
	Apply low - temp solder alloys (≤200°C). 
	Secure FPC with carrier plates during soldering. 
	Optimize soldering, limit heating rate to ≤3°C/s.

1.Test Items: 
	Environmental: Thermal cycling (-40°C~+125°C), damp heat (85°C/85%RH); 
	Mechanical: Bend fatigue life, vibration (10-2000Hz); 
	Electrical: Insulation resistance, Hi-Pot, signal loss. 
2.Standard Differences: 
	Consumer-grade: Passes routine environmental tests (e.g., 100 thermal cycles); 
	Aerospace-grade: Withstands extreme environments (-196°C~+200°C), radiation tests and requires bend life ≥1 million cycles

Cost Drivers: 
	1.Materials: RA copper (30%-50% pricier than ED) and thin PI substrates raise costs. 
	2.Complex processes: Multi-layer, rigid-flex, micro-vias (≤0.1mm) increase expenses. 
	3.Order scale: High NRE allocation for prototypes/small batches. 
Optimization: 
	1.Substitute materials: Use PET for non-high-temp applications. 
	2.Simplify design: Reduce layers, widen traces; avoid blind/buried vias. 
	3.Mass production: V-scoring/panelization to boost material efficiency.

PCBMASTER

Blog & NEWS

We offer an all - inclusive experience. Let us take you on a journey to explore the world of wiring and get you familiar with us.

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Ready to Solve Your
Flexible PCB Challenges?

Whether you need material selection advice, design optimization, or manufacturing support, our team of experts is ready to help.

Free Design Review

Comprehensive analysis of your FPC design for manufacturability

Custom Solution Proposal

Tailored technical proposal with cost and timeline estimates

Prototype & Testing

Rapid prototyping with full environmental testing capabilities

Get Started

Flexible PCBs Manufacturer

100+

99.9%

50+

98.6%

PCBMASTER Flexible PCBs Advantages

The Products We Make

Ultra-thin double-sided 0.08mm

4Layer FPC

PI Transparent Material FPC

6Layer Inductor Coil FPC

FPC Prototype

FPC+FPC Assembly

Advanced Flexible Circuit Solutions

Research Institute of a University Rigid-Flex Project

Transforming an 8-layer rigid-flex design into a cost-effective 4-layer FPC solution for industrial control sensors

Design Review

Feasibility Assessment

Optimization Proposal

Validation & Delivery

Technical Specifications

Project Background

Design Features

Technical Questions

5G mmWave Radar FPC

Challenge

Solution

Implantable Cardiac Monitor

Challenge

Solution

Satellite Antenna Foldable FPC

Challenge

Solution

Flexible Printed Circuit (FPC) Capabilities

Core Capabilities

Precision & Size

Manufacturing Engineer

Monthly Production Capacity

Full Technical Specifications

Manufacturing Process Flow

1. Cutting Material

2. Drilling

3. Copper Plating/Electroplating

4. Circuit/ETCH

5. Stackup

6. Immersion Gold

7. Silkscreen

8. AOI & Final Test

9. Routing and Die Cut

Quality Certification System

IATF 16949

ISO 13485

ISO 9001

ISO 14001

ISO 45001

FAQs of Flexible PCB

Blog & NEWS

Ready to Solve Your Flexible PCB Challenges?

Free Design Review

Custom Solution Proposal

Prototype & Testing

Send Us Your Inquiry

Research Institute of a University

Rigid-Flex Project

Ready to Solve Your
Flexible PCB Challenges?