Specialized in Complex PCB&PCBA Manufacturing

Aerospace / Medical-Grade

Flex PCBs Manufacturer

PCBMASTER specializes in high-performance flexible printed circuits for demanding applications

  • 100+

    Complex Projects Completed

  • 99.9%

    Customer Satisfaction Rate

  • 50+

    Patented Technologies

  • 98.6%

    On-time Delivery Rate

PCBMASTER Flex PCBs Advantages

PCBMASTER Flex PCBs Advantages

PCBMASTER Proactively Provides Cost Optimization Suggestions

PCBMASTER engineers analyze your designs and manufacturing costs, then tailor optimizations (design, materials, stackup) and DFM analysis to your product's needs. This proactive approach cuts costs at the source while enhancing quality, performance, and value.

The Products We Make

Customized FPCs, your own circuit solution.

Ultra-thin double-sided 0.08mm

Ultra-thin double-sided 0.08mm

0.08mm ThicknessImmersion gold
  • Track/Spacing: 0.075/0.075mm
  • Material: PI Polyimide Adhesive-Free Rolled Substrate
  • Special technology: Ultra-Thin Double-Sided + Coverlay.Finsih thick ness 0.08mm
4Layer FPC

4Layer FPC

0.18mm ThicknessGold finger
  • Track/Spacing: 0.065/0.06mm
  • Material: DuPont PI Polyimide Adhesive-Free Rolled Substrate
  • Special technology: Soft Ink, Electromagnetic Shielding Film, FR-4 Stiffener, PI Stiffener
PI Transparent Material FPC

PI Transparent Material FPC

0.10mm ThicknessImmersion gold
  • Track/Spacing: 0.10/0.10mm
  • Material: PI Polyimide Transparent High-Temperature Resistant Material
  • Special technology: PI High-Temperature Resistant Material, Ultra-Thin Custom Transparent Material
6Layer Inductor Coil FPC

6Layer Inductor Coil FPC

0.28mm ThicknessImmersion gold
  • Track/Spacing: 0.075/0.10mm
  • Material: Panasonic PI Polyimide Adhesive-Free Rolled Substrate
  • Special technology: Panasonic Imported Materials, High-Precision and High-Alignment Coil

FPC Prototype

Special Offer
  • QTY: 5pcs
  • Layer: 1 or 2 layer
  • Surface finish: Immersion gold 1u"
  • Size: ≤100*100mm
  • FPC thickness: 0.1 or 0.11mm
  • Board type: Single piece
$ 5.00usd

FPC+FPC Assembly

Free Stencil
  • QTY: 5PCS
  • Layer: 1 or 2 layer
  • Size: ≤100*100mm
  • Types of components: ≤40
  • Total components: ≤400
  • SMD stencil: Free
$ 40.00usd

Advanced Flex Circuit Solutions

Professional R&D and manufacturing team, 20 Years of PCB experience, Dive into a world of innovative PCB possibilities

Research Institute of a University

Rigid-Flex Project

90%
Cost Reduction
40 days
Project Duration
100%
Design Compliance
50%
Weight Reduction
Rigid-Flex Project

Transforming an 8-layer rigid-flex design into a cost-effective 4-layer FPC solution for industrial control sensors

Background

  1. Design Review

    Comprehensive analysis of your DXF design files and requirements

  2. Feasibility Assessment

    Evaluation of manufacturing feasibility and potential risks

  3. Optimization Proposal

    Tailored design optimization proposal with cost projections

  4. Validation & Delivery

    Prototype manufacturing, testing, and final solution delivery

Technical Specifications

Flex PCB
Layers4 - layer pure FPC with PI reinforcement
Finished Thickness0.23mm
PI Reinforcement0.20mm thickness
Copper Thickness0.5oz base, 25 - 35μm finished
SubstrateRolled annealed copper
Surface FinishImmersion gold

Project Background

Back

Research Institute of a University approached us with a complex 8-layer rigid-flex board design for an industrial control sensor, seeking manufacturing feasibility and cost optimization.

Design Features

  • Central rigid board area with surrounding flexible layers
  • Chip placement in both rigid and flexible zones (3.5mm×3.5mm)
  • Complex layer stackup with tight spacing requirements

Technical Questions

  1. Does the design spacing meet rigid-flex minimum requirements?
  2. What are the process risks of placing 3.5mm×3.5mm chips in both zones?
  3. Recommended reliability measures for rigid-flex junctions?
  4. Are critical design adjustments needed for manufacturability?
  5. Potential manufacturing or reliability risks to be addressed?

"The optimized 4-layer FPC solution not only met all original design requirements but also achieved an impressive 90% cost reduction. The project was completed within 40 days, far exceeding our expectations."

— Project Manager, University of Hong Kong

5G mmWave Radar FPC

High-frequency solution for automotive 77GHz radar

0.42dB
Insertion Loss @77GHz
1.8°
Phase Deviation
5G mmWave Radar FPC
"

0.42dB/cm insertion loss beats industry standard by 30%

— Automotive Electronics Engineer

"

Challenge

Design antenna FPC for 77GHz radar with:

  • 50Ω±10% characteristic impedance at 10GHz
  • ≤0.5dB/cm insertion loss at 77GHz
  • ≤2° phase error at 5mm bend radius

Solution

  • Rogers RO3003® laminate (Dk=3.0, Df=0.0013)
  • 3-layer stackup with microstrip and ground planes
  • HDI technology for ±5μm trace tolerance

Implantable Cardiac Monitor

ISO 13485 certified solution for pacemaker interconnects

1.2×10⁹
Insulation Resistance (Ω)
98%
Cell Viability Rate
Implantable Cardiac Monitor
"

18 months of faultless operation in animal trials, 92% defect rate reduction vs original supplier

— R&D Director, Global Medical Device Leader

"

Challenge

Develop ultra-thin FPC for pacemakers with:

  • ≤0.1mm thickness for dynamic heart movement
  • 10⁹Ω insulation after 134°C autoclave sterilization
  • Zero biocompatibility failures in cytotoxicity tests

Solution

  • DuPont Kapton® PI-HS substrate (50μm) with halogen-free adhesive
  • 9μm RA copper foil with 1μm gold plating for oxidation resistance
  • Laser drilling (50μm) and LPI coverlay for seamless encapsulation

Satellite Antenna Foldable FPC

LEO satellite solution for extreme space environments

0.3dB
Signal Loss Increase
28K+
Thermal Cycles Survived
Satellite Antenna Foldable FPC
"

2+ years of satellite operation, far exceeding NASA-STD-8739.8 requirements

— Project Engineer, Aerospace Group

"

Challenge

Design foldable FPC for LEO satellites with:

  • -196°C to +125°C operating temperature range
  • ≥1×10⁵ Gy radiation tolerance (gamma rays)
  • ≤1.5dB signal loss at 5GHz after 1M folds

Solution

  • Asahi Kasei AP850 fluorinated PI substrate (1×10⁶ Gy tolerance)
  • 5μm Parylene C coating for radiation shielding
  • Ω serpentine routing with 30% length redundancy

Flexible Printed Circuit (FPC)Capabilities

Comprehensive technical specifications for flexible printed circuits from 2025 to 2027

Type 202520262027Remark
Materials Flexible substrate Non-adhesive substrate, Adhesive substrate, LCP Non-adhesive substrate, Adhesive substrate, LCP Non-adhesive substrate, Adhesive substrate, LCP /
StiffenerPI, FR4, steel, AluminiumPI, FR4, steel, AluminiumPI, FR4, steel, Aluminium/
Adhesive SheetEpoxy glue, acrylic glueEpoxy glue, acrylic glueEpoxy glue, acrylic glue/
Covering filmEpoxy glue, acrylic glueEpoxy glue, acrylic glueEpoxy glue, acrylic glueAcrylic adhesive is the main type.
LayerFlexible121416/
Thickness FinishedMin 0.03mmMin 0.03mmMin 0.03mmsingle side FPC
ToleranceMin ±0.015mmMin ±0.015mmMin ±0.015mm/
Finished copper Inner copper1/3 - 2oZ1/4 - 2oZ1/4 - 2oZBase copper thickness
outer copper1/3 - 2oZ1/4 - 3oZ1/4 - 3oZBase copper thickness
Size Max SizeMin 2mm*10mmMin 2mm*10mmMin 2mm*5mm/
Min SizeMax 500mm*610mmMax 500mm*610mmMax 500mm*610mm/
Track/Spacing Inner Layer2mil/2mil2mil/2mil1.8mil/1.8milFinished Copper 0.5oZ
Out Layer2mil/2mil2mil/2mil1.8mil/1.8milFinished Copper 1oZ
Finish hole size CNC hole sizeMin 0.1mmMin 0.1mmMin 0.1mm/
Laser hole sizeMin 0.075mmMin 0.075mmMin 0.05mm/
Thickness to diameter CNC DrillingMax 1:1Max 1:1Max 1:1/
Laser drillingMax 12:1Max 15:1Max 15:1/
Dielectric thickness flexible coreMin 0.0125mmMin 0.0125mmMin 0.0125mm/
Dimensional tolerance Laser cutting±0.05mm±0.05mm±0.05mmUV laser cutting
Die cuttingMin 0.05mmMin 0.05mmMin 0.05mmSlow wire cutting steel die
Order TypeSizeStandard Lead TimeExpedited Service
Prototypes≤3 ㎡5 - 6 daysExpedited shipment available in 1 - 2 days
Small Batch3 - 10 ㎡8 - 9 daysExpedited shipment available in 5 - 6 days
Mass Production≥10 ㎡9 - 11 daysExpedited shipment available in 7 - 8 days

Manufacturing Process Flow

Cutting Material

1. Cutting Material

Drilling

2. Drilling

Copper Plating/Electroplating

3. Copper Plating/Electroplating

Circuit/ETCH

4. Circuit/ETCH

Stackup

5. Stackup

Immersion Gold

6. Immersion Gold

Silkscreen

7. Silkscreen

AOI & Final Test

8. AOI & Final Test

Routing and Die Cut

9. Routing and Die Cut

Quality Certification System

We manufacture 100% of our products in accordance with international quality certificates.

IATF 16949

IATF 16949

IATF 16949 Certificate
ISO 13485

ISO 13485

ISO 13485 Certificate
ISO 9001

ISO 9001

ISO 9001 Certificate
ISO 14001

ISO 14001

ISO 14001 Certificate
ISO 45001

ISO 45001

ISO 45001 Certificate

FAQsof Flex PCB

Below are the FPC Frequently Asked Questions, if you have any other questions, please feel free to contact us.

①Typical FPC: 50μm/50μm (2mil). High-precision FPC: 25μm/25μm (1mil). 
② Key factors: Material thickness, manufacturing process (laser etching enables finer lines), and reliability under bending (thinner lines are more fragile).
PCBMASTER

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Ready to Solve Your

Flex PCB Challenges?

Whether you need material selection advice, design optimization, or manufacturing support, our team of experts is ready to help.

Free Design Review

Comprehensive analysis of your FPC design for manufacturability

Custom Solution Proposal

Tailored technical proposal with cost and timeline estimates

Prototype & Testing

Rapid prototyping with full environmental testing capabilities

Get Started

Send Us Your Inquiry

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