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PCB Prototype
High-Layer Multilayer PCB
High-Layer Multilayer PCB
HDI PCB
HDI PCB
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High-Frequency PCBs
High-Speed PCBs
High-Speed PCBs
Flexible PCB
Flexible PCB
Rigid-Flex PCB
Rigid-Flex PCB
Metal Base-PCB
Metal Base-PCB
Alumina&AlN Ceramic-PCB
Alumina&AlN Ceramic-PCB
Mini LED Light-PCB
Mini LED Light-PCB
Ultra-Long PCBs
Ultra-Long PCBs
Special-type PCB
Special-type PCB
IC Substrate
IC Substrate
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Quick-turn PCB/PCBA

Quick-turn PCB/PCBA

Schnell
Standard PCB/PCBA

Standard PCB/PCBA

Advanced PCB/PCBA

Advanced PCB/PCBA

Heiß
Flex/Rigid-Flex PCB/PCBA

Flex/Rigid-Flex PCB/PCBA

PCB Montage

PCB Montage

View the definitions and differences regarding Quick-turn PCB, Standard PCB, and Advanced PCB

Quick-turn PCB/PCBA

PCB specification parameters
X mm
pcs

Prozessoptionen

HASL lead free
HASL with lead
Immersion gold(ENIG)
OSP
No surface
Immersion tin
Immersion silver(Ag)
Immersion Nickel-plated gold
Hard gold

Erweiterte Optionen

HDI-Buried/blind vias
Customer stackup
RF Material+FR-4 mixed stackup
Impedance control
Half-cut/Castellated Holes
Edge Plating
Gold finger
Drill-step Deep Control
Back drill deep control
Buried and embedded copper block
Buried resistance-capacitance
Print serial number
Peelable soldermask
Thermoelectric heat dissipation
Insulation for plug-in components
Copper-Aluminum mixed
Aluminum-based superconductors
Copper-based superconductors
Via filled with resin
Via filled with copper paste
Plated Via plugging
Via in pad
Circuit rework unacceptable
Hole copper thickness≧25UM
Countersinks/Counterbores
Gold Plating for Leadless PCB
Precision routing±0.05mm
Confirm work file

Kundenspezifische Optionen

Leiterplattenbestückungsservice

Die oben genannten Leiterplatten erfordern eine Leiterplattenbestückung

PCB Build Time
PCB Fee
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