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Security

The mainstream intelligent security systems are mainly classified into three categories: video structuring, biometric identification, and object recognition. Their application fields are quite extensive, including safe cities, intelligent transportation, intelligent buildings, finance, energy, culture, education, and health. PCB circuit boards play an extremely crucial role in security products. PCB MASTER has won unanimous praise from security customers and established long-term and stable cooperation with them by virtue of its outstanding cost advantages and stable product quality.

HDI PCB-Security technical ability
Items		2024		2025		2026
Items		volume	sample	volume	sample	volume	sample
Layer count		≤24L	≤36L	≤24L	≤36L	≤24L	≤36L
Stack-up		3+N+3	4+N+4	4+N+4	Anylayer(10L)	Anylayer(10L)	Anylayer(12L)
Dimension(mm)	MAX	620*725mm	620*810mm	620*725mm	620*1092mm	620*725mm	620*1092mm
Board thickness(mm)	MAX	3.2mm	4.2mm	3.2mm	4.2mm	3.2mm	4.2mm
lmpedance tolerance	Diff>50ohm	土10%	土7%	土10%	土7%	土8%	土7%
lmpedance tolerance	Single 50ohm	土10%	土8%	土8%	土6%	土8%	土6%
Layer registration	≤12L	≥5mil	≥4mil	≥5mil	≥4mil	≥4mil	≥3mil
	>12L	≥7mil	≥5mil	≥6mil	≥5mil	≥5mil	≥4mil
	N+N	≥7mil	≥5mil	≥7mil	≥5mil	≥5mil	≥4mil
Pattern accuracy	≤500mm	±4mil	±4mil	±4mil	±4mil	±4mil	±4mil
Pattern accuracy	>500mm	±5mil	±5mil	±5mil	±5mil	±5mil	±5mil
Laser blind hole		100/225um	75/200um	75/200um	75/180um	75/180um	65/165um
Dimple		25um	15um	20um	10um	20um	10um
Plating aspect ratio for via hole		14:1	16:1	14:1	16:1	14:1	16:1
Back- drill	Back-drill size (min)	0.45mm	0.4mm	0.45mm	0.4mm	0.4mm	0.35mm
	STUB (min)	8mil	6mil	8mil	6mil	6mil	5mil
	Back-drill to copperdistance (min)	7mil	5mil	7mil	5mil	5mil	5mil
Special technology	POFV	yes	yes	yes	yes	yes	yes
	N+N	yes	yes	yes	yes	yes	yes
	Hybrid lamination	yes	yes	yes	yes	yes	yes
	Blind hole	yes	yes	yes	yes	yes	yes
	Metallized half hole	yes	yes	yes	yes	yes	yes

PCB-Security technical ability
Items	2024		2025		2026
Items	volume	sample	volume	sample	volume	sample
Max layers	12	16	14	16	14	16
Set/Unit(mm)	7301245/7101200	7301245/7101200	7301245/7101200	7301245/7101200	7301245/7101200	7301245/7101200
Board thickness(mm)	0.5-4.0	0.5-4.0	0.5-4.0	0.5-4.0	0.5-4.0	0.5-4.0
Min thickness(8Lmm)	0.9	0.8	0.9	0.8	0.9	0.8
Min thickness(10Lmm)	1.10	1.00	1.10	1.00	1.10	1.00
Thickness tolerance	±8%	±8%	±8%	±8%	±8%	±8%
Warping	≤1%	≤0.75%	≤0.75%	≤0.50%	≤0.75%	≤0.50%
Inner copper thickness	1/3oZ-4oZ	1/3oZ-4oZ	1/3oZ-4oZ	1/3oZ-4oZ	1/3oZ-4oZ	1/3oZ-4oZ
Outer copper thickness	HoZ-2oZ	HoZ-3oZ	HoZ-2oZ	HoZ-3oZ	HoZ-2oZ	HoZ-3oZ
Min trace width/distance（Inner/um)	75/70	60/60	70/70	60/60	65/65	60/60
Min trace width/distance（Outer/um)	75/75	75/75	70/70	70/70	65/65	65/65
Min BGA(mm)	0.2	0.2	0.2	0.2	0.2	0.2
Min hole (mm)	0.2	0.15	0.2	0.15	0.2	0.15
Max aspect ratio	14:1	20:1	16:1	20:1	18:1	20:1
Impedance(>= 50ohm)	±10%	±8%	±10%	±8%	±10%	±8%
Impedance(< 50ohm)	±5ohm	±5ohm	±5ohm	±5ohm	±5ohm	±5ohm
Solder mask(um)	±25	±20	±25	±20	±25	±20
Min Solder mask bridge(mm)	0.08	0.06	0.08	0.06	0.08	0.06
Dimensional tolerance(mm)	±0.1	±0.075	±0.1	±0.075	±0.1	±0.075
Finished surface	lmmersion gold(ENG)、HASL、OSP、lmmersion silver(Ag)、Immersion tin、Hard gold、Electric gold finger

FLEX technical capability
Items		2024		2025		2026		remark
		volume	sample	volume	sample	volume	sample
Material	Flexible substrate	Non-adhesive substrate, adhesive substrate、LCP		Non-adhesive substrate, adhesive substrate、LCP		Non-adhesive substrate, adhesive substrate、LCP
	Stiffener	PI、FR4、 steel、Aluminium		PI、FR4、 steel、Aluminium		PI、FR4、 steel、Aluminium
	PP	Epoxy glue, acrylic glue		Epoxy glue, acrylic glue		Epoxy glue, acrylic glue
	Covering film	Epoxy glue, acrylic glue		Epoxy glue, acrylic glue		Epoxy glue, acrylic glue
Layers	Flexible	4L		6L		8L
Thickness	Finished	Min 0.03mm		Min 0.03mm		Min 0.03mm		1L FLEX
	Tolerance	Min ±0.015mm		Min ±0.015mm		Min ±0.015mm
Finished copper	Inner copper	1/3-1oZ		1/3-2oZ		1/3-2oZ		Base copper thickness
	Outer copper	1/3-2oZ		1/3-3oZ		1/3-3oZ		Base copper thickness
Dimension	Min	20mm*20mm		10mm*10mm		5mm*5mm
	Max	500mm*610mm		500mm*610mm		500mm*610mm
Trace width/distance	Inner layer	2mil/2mil		2mil/2mil		1.8mil/1.8mil		Finished copper 0.5oZ
	Outer layer	2mil/2mil		2mil/2mil		1.8mil/1.8mil		Finished copper 1oZ
Finished hole	Drilling	Min 0.1mm		Min 0.1mm		Min 0.1mm
	Laser drilling	Min 0.075mm		Min 0.075mm		Min 0.05mm
Thickness to diameter	Drilling	Max 1:1		Max 1:1		Max 1:1
	Laser drilling	Max 12:1		Max 15:1		Max 15:1
Dielectric thickness	Flexible core	Min 0.0125mm		Min 0.0125mm		Min 0.0125mm
Dimensional tolerance	Laser cutting	±0.05mm		±0.05mm		±0.05mm		UV Laser cutting
	Die-cutting	Min 0.05mm		Min 0.05mm		Min 0.05mm		Slow wire die cutting

Rigid-FLEX technical capability
Items	units	2024		2025		2026
Items	units	volume	sample	volume	sample	volume	sample
Medium thickness(FLEX )	mm	0.025~0.10	0.025~0.15	0.025~0.15	0.013~0.15	0.013~0.15	0.013~0.15
Surface smoothness	um	50	50	50	30	30	30
Min distance hole to Window	mm	0.8	0.5	0.5	0.4	0.4	0.4
Min distance trace to Window	mm	0.4	0.2	0.2	0.2	0.2	0.2
Window Excess glue	mm	1.00	0.5	0.5	0.3	0.3	0.3
Min window width	mm	3.5	3	3	2.6	2.6	2.6
FLEX finished copper	oZ	0.5-2	0.5-2	0.33-2	0.33-2	0.33-2	0.33-2
Rigid finished copper	oZ	0.5-4	0.33-4	0.33-4	0.33-4	0.33-4	0.33-4
Min trace width/distance	mm	0.075/0.075	0.06/0.06	0.05/0.05	0.05/0.05	0.05/0.05	0.04/0.04
Min thickness	mm	0.35	0.3	0.3	0.25	0.25	0.25
Impedance	%	±10	±10	±8	±7	±7	±5
Warping	%	≤0.75	≤0.50	≤0.75	≤0.50	≤0.50	≤0.50
Min finished PTH	mm	0.15	0.1	0.15	0.1	0.1	0.1
Depth milling	mm	±0.075	±0.075	±0.075	±0.075	±0.075	±0.075
HDI-RF laser step	/	2step	3step	2step	3step	3step	3step
FLEX quantity (hinge)	/	≤4	≤6	≤6	≤8	≤8	≤10
FLEX quantity(bonding)	/	≤2	≤2	≤2	≤2	≤2	≤2

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