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Photovoltaic

With the rapid and comprehensive development of multimedia services, including telephony, cable television (CATV), digital television and the Internet, the requirements for circuit bandwidth and capacity have increased dramatically. Against this backdrop, the concept of optoelectronic printed circuit boards has been put forward. Briefly speaking, an optoelectronic printed circuit board is a new generation of packaging substrate required for high computing, which integrates light and electricity, uses light for signal transmission and electricity for computing. It adds a light-guiding layer to the currently very mature traditional printed circuit board. As a result, the application of circuit boards has developed from the current electrical connection technology to the field of optical transmission.

PCB-photoelectricity technical capability
Items		2024		2025		2026
Items		volume	sample	volume	sample	volume	sample
Layers		2~10	16	2~10	16	2~10	16
Set/Unit(mm)		7251245 / 6501100	7251245 / 6501100	7251245 / 6501100	7251245 / 6501100	7251245 / 6501100	7301250 / 6501100
Board thickness (mm)		0.4-4.0	0.4-4.0	0.4-4.0	0.4-4.0	0.4-4.0	0.4-4.0
Min&max base copper thickness (oz)		1/3oz & 4oz	1/3oz & 4oz	1/3oz & 4oz	1/3oz & 4oz	1/3oz & 4oz	1/3oz & 4oz
Min trace width/distance （Inner/mm)		0.075/0.075	0.065/0.065	0.075/0.075	0.06/0.06	0.06/0.06	0.05/0.05
Min trace width/distance （Outer/mm)		0.075/0.075	0.065/0.065	0.075/0.075	0.06/0.06	0.06/0.06	0.05/0.05
Layer registration (mm)		0.125	0.1	0.125	0.1	0.115	0.1
Min BGA(mm)		0.2	0.2	0.2	0.2	0.2	0.2
Min hole (mm)		0.2	0.15	0.2	0.15	0.2	0.15
Max aspect ratio		14:1	20:1	16:1	20:1	16:1	20:1
Impedance(>= 50ohm）		土10%	土8%	土10%	土8%	土10%	土8%
Impedance(<50ohm)		土5ohm	土5ohm	土5ohm	土5ohm	土5ohm	土5ohm
Solder mask(um)		土25	土20	土20	土15	土20	土10
Min Solder mask bridge(mm)		0.08	0.08	0.08	0.07	0.07	0.06
Dimensional tolerance (mm)		土0.10	土0.08	土0.10	土0.08	土0.10	土0.075
Optical mark position tolerance(mm)		土0.025	土0.015	土0.025	土0.015	土0.025	土0.015
Optical Mark size tolerance(%)		土15	土10	土15	土10	土10	土10
CNC Fillet dimension tolerance(mm)		土0.127	土0.10	土0.127	土0.10	土0.10	土0.10
Goldfinger length tolerance(%)		土15%	土10%	土15%	土10%	土10%	土10%
Goldfinger width tolerance(%)		土15%	土10%	土15%	土10%	土10%	土10%
Goldfinger alignment mark position tolerance(mm)	≤300mm	土0.07	土0.06	土0.06	土0.05	土0.05	土0.05
	300-500mm	土0.08	土0.07	土0.08	土0.07	土0.08	土0.07
	≥500mm	土0.09	土0.08	土0.09	土0.08	土0.09	土0.08
gold finger & fiducial mark alignment dimension tolerance(%)		土15	土10	土15	土10	土10	土10
gold finger pitch tolerance (mm)		土0.025	土0.02	土0.025	土0.015	土0.02	土0.015
ExpansivityPPM）		土300	土200	土200	土150	土150	土150
Pad position tolerance(mm)		土0.025	土0.015	土0.025	土0.015	土0.025	土0.015
Pad size tolerance(%)		土15%	土10%	土10%	土10%	土10%	土10%
types of compensation		1.global compensation ； 2.locality compensation
copper solder mask opening tolerance(%)		土10	土7	土10	土7	土10	土7
PCB thickness tolerance	<1.0mm	土0.10mm	土0.06mm	土0.08mm	土0.06mm	土0.08mm	土0.06mm
PCB thickness tolerance	≥1.0mm	土10%	土8%	土10%	土8%	土10%	土8%
Warping	≥333mm	≤1%	≤1%	≤1%	≤1%	≤1%	≤1%
Warping	<333mm	≤0.75%	≤0.75%	≤0.75%	≤0.75%	≤0.50%	≤0.50%

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