PCB-Computer through hole technology ability | ||||||
Items | 2024 | 2025 | 2026 | |||
volume | sample | volume | sample | volume | sample | |
Max layers | 12 | 16 | 14 | 16 | 14 | 16 |
Set/Unit(mm) | 730*1245/ | 730*1245/ | 730*1245/ | 730*1245/ | 730*1245/ | 730*1245/ |
Board thickness(mm) | 0.5-4.0 | 0.5-4.0 | 0.5-4.0 | 0.5-4.0 | 0.5-4.0 | 0.5-4.0 |
Min thickness(8L mm) | 0.9 | 0.8 | 0.9 | 0.8 | 0.9 | 0.8 |
Min thickness(10L mm) | 1.10 | 1.00 | 1.10 | 1.00 | 1.10 | 1.00 |
Thickness tolerance | ±8% | ±8% | ±8% | ±8% | ±8% | ±8% |
Warping | ≤1% | ≤0.75% | ≤0.75% | ≤0.50% | ≤0.75% | ≤0.50% |
Inner copper thickness | 1/3oZ-4oZ | 1/3oZ-4oZ | 1/3oZ-4oZ | 1/3oZ-4oZ | 1/3oZ-4oZ | 1/3oZ-4oZ |
Outer copper thickness | HoZ-2oZ | HoZ-3oZ | HoZ-2oZ | HoZ-3oZ | HoZ-2oZ | HoZ-3oZ |
Min trace width/distance | 75/70 | 60/60 | 70/70 | 60/60 | 65/65 | 60/60 |
Min trace width/distance | 75/75 | 75/75 | 70/70 | 70/70 | 65/65 | 65/65 |
Min BGA(mm) | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 |
Min hole (mm) | 0.2 | 0.15 | 0.2 | 0.15 | 0.2 | 0.15 |
Max aspect ratio | 14:1 | 20:1 | 16:1 | 20:1 | 18:1 | 20:1 |
impedance(>= 50ohm) | ±10% | ±8% | ±10% | ±8% | ±10% | ±8% |
impedance(< 50ohm) | ±5ohm | ±5ohm | ±5ohm | ±5ohm | ±5ohm | ±5ohm |
Solder mask(um) | ±25 | ±20 | ±25 | ±20 | ±25 | ±20 |
Min Solder mask bridge(mm) | 0.08 | 0.06 | 0.08 | 0.06 | 0.08 | 0.06 |
Dimensional tolerance(mm) | ±0.1 | ±0.075 | ±0.1 | ±0.075 | ±0.1 | ±0.075 |
Finished surface | lmmersion gold(ENG)、HASL、OSP、lmmersion silver(Ag)、Immersion tin、Hard gold、Electric gold finger | |||||
HDI PCB-Computer technical ability | |||||||
Items | 2024 | 2025 | 2026 | ||||
volume | sample | volume | sample | volume | sample | ||
layer count | ≤24L | ≤36L | ≤24L | ≤36L | ≤24L | ≤36L | |
stack-up | 3+N+3 | 4+N+4 | 4+N+4 | Anylayer(10L) | Anylayer(10L) | Anylayer(12L) | |
Dimension(mm) | MAX | 620*725mm | 620*810mm | 620*725mm | 620*1092mm | 620*725mm | 620*1092mm |
Board thickness(mm) | MAX | 3.2mm | 4.2mm | 3.2mm | 4.2mm | 3.2mm | 4.2mm |
lmpedance tolerance | Diff>50ohm | 土10% | 土7% | 土10% | 土7% | 土8% | 土7% |
single 50ohm | 土10% | 土8% | 土8% | 土6% | 土8% | 土6% | |
Layer registration | ≤12L | ≥5mil | ≥4mil | ≥5mil | ≥4mil | ≥4mil | ≥3mil |
>12L | ≥7mil | ≥5mil | ≥6mil | ≥5mil | ≥5mil | ≥4mil | |
N+N | ≥7mil | ≥5mil | ≥7mil | ≥5mil | ≥5mil | ≥4mil | |
Pattern accuracy | ≤500mm | ±4mil | ±4mil | ±4mil | ±4mil | ±4mil | ±4mil |
>500mm | ±5mil | ±5mil | ±5mil | ±5mil | ±5mil | ±5mil | |
laser blind hole | 100/225um | 75/200um | 75/200um | 75/180um | 75/180um | 65/165um | |
dimple | 25um | 15um | 20um | 10um | 20um | 10um | |
plating aspect ratio for via hole | 14:1 | 16:1 | 14:1 | 16:1 | 14:1 | 16:1 | |
Back- drill | back-drill size (min) | 0.45mm | 0.4mm | 0.45mm | 0.4mm | 0.4mm | 0.35mm |
STUB (min) | 8mil | 6mil | 8mil | 6mil | 6mil | 5mil | |
Back-drill to copperdistance (min) | 7mil | 5mil | 7mil | 5mil | 5mil | 5mil | |
Special technology | POFV | yes | yes | yes | yes | yes | yes |
N+N | yes | yes | yes | yes | yes | yes | |
Hybrid lamination | yes | yes | yes | yes | yes | yes | |
Blind hole | yes | yes | yes | yes | yes | yes | |
Metallized half hole | yes | yes | yes | yes | yes | yes | |
High speed material library | |||||||||||
Loss | DF 10GHz | Class | ITEQ | EMC | TUC | Panasonic | NOUYA | WAZAM | ShengYi | lsola | AGC Nelco |
Std loss | >0.018 | Class 1 | IT-158 | EM-825/I | TU-668 | R-1566W/WN | NY2150/M | H150(LF)/(LF)Z | S1000/H | 185 HR/370HR | / |
Mid loss | 0.018-0.012 | Class 2 | IT-170GRA | EM-370(D)/(5)/(Z) | TU-862 HF | / | / | H175HF | S7045G | / | / |
0.012-0.009 | Class 3 | IT-170GT | EM-828G | TU 862(S) | M2 | NY3170M | H175HFZ | S7040G | IS415 | / | |
Low loss | 0.009-0.007 | Class 4 | IT-170GRA2 | EM-526 | TU-872SLK | M4/M4S | NY3170M2/LK | H180HF | S7439/HW | FR408 | N4000-13 |
0.007-0.006 | Class 5 | IT-958G | EM-888K | TU-872SLKSp | / | / | / | / | / | N4000-13 | |
Very low loss | 0.006-0.005 | Class 6 | IT-968 | EM-528 | TU-883 | M6/G | NY6300SL NY6300S | H360/ (Z) | S6GX | TerraGreen | / |
0.005-0.004 | Class 7 | IT-988G | EM-528K | TU-883SP/A | M6N | / | / | / | Tachyon-100G | MW2000 | |
Ultra low loss | 0.004-0.002 | Class 7.5 | IT-988GSE | EM-890K | TU-933/+ | M7N | / | / | / | / | MW4000 |
Extreme low loss | 0.002-0.0012 | Class 8 | / | / | TU943SN | / | NYP4 | / | / | / | / |
<0.0012 | Class 8.5 | / | EM-892K2 | TU943SR | M8U | / | / | / | / | / | |
FLEX technical capability | ||||||||
Items | 2024 | 2025 | 2026 | remark | ||||
volume | sample | volume | sample | volume | sample | |||
Material | Flexible substrate | Non-adhesive substrate, | Non-adhesive substrate, | Non-adhesive substrate, |
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Stiffener | PI、FR4、 steel、Aluminium | PI、FR4、 steel、Aluminium | PI、FR4、 steel、Aluminium |
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PP | Epoxy glue, acrylic glue | Epoxy glue, acrylic glue | Epoxy glue, acrylic glue |
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Covering film | Epoxy glue, acrylic glue | Epoxy glue, acrylic glue | Epoxy glue, acrylic glue |
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Layers | Flexible | 4L | 6L | 8L |
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Thickness | Finished | Min 0.03mm | Min 0.03mm | Min 0.03mm | 1L FLEX | |||
Tolerance | Min ±0.015mm | Min ±0.015mm | Min ±0.015mm |
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Finished copper | Inner copper | 1/3-1oZ | 1/3-2oZ | 1/3-2oZ | Base copper thickness | |||
Outer copper | 1/3-2oZ | 1/3-3oZ | 1/3-3oZ | Base copper thickness | ||||
Dimension | Min | 20mm*20mm | 10mm*10mm | 5mm*5mm |
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Max | 500mm*610mm | 500mm*610mm | 500mm*610mm |
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Trace width/distance | Inner layer | 2mil/2mil | 2mil/2mil | 1.8mil/1.8mil | Finished copper 0.5oZ | |||
Outer layer | 2mil/2mil | 2mil/2mil | 1.8mil/1.8mil | Finished copper 1oZ | ||||
Finished hole | Drilling | Min 0.1mm | Min 0.1mm | Min 0.1mm |
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Laser drilling | Min 0.075mm | Min 0.075mm | Min 0.05mm |
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Thickness to diameter | Drilling | Max 1:1 | Max 1:1 | Max 1:1 |
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Laser drilling | Max 12:1 | Max 15:1 | Max 15:1 |
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Dielectric thickness | Flexible core | Min 0.0125mm | Min 0.0125mm | Min 0.0125mm |
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Dimensional tolerance | Laser cutting | ±0.05mm | ±0.05mm | ±0.05mm | UV Laser cutting
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Die-cutting | Min 0.05mm | Min 0.05mm | Min 0.05mm | Slow wire die cutting | ||||
Rigid-FLEX technical capability | |||||||
Items | units | 2024 | 2025 | 2026 | |||
volume | sample | volume | sample | volume | sample | ||
Medium thickness(FLEX ) | mm | 0.025~0.10 | 0.025~0.15 | 0.025~0.15 | 0.013~0.15 | 0.013~0.15 | 0.013~0.15 |
Surface smoothness | um | 50 | 50 | 50 | 30 | 30 | 30 |
Min distance hole to Window | mm | 0.8 | 0.5 | 0.5 | 0.4 | 0.4 | 0.4 |
Min distance trace to Window | mm | 0.4 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 |
Window Excess glue | mm | 1.00 | 0.5 | 0.5 | 0.3 | 0.3 | 0.3 |
Min window width | mm | 3.5 | 3 | 3 | 2.6 | 2.6 | 2.6 |
FLEX finished copper | oZ | 0.5-2 | 0.5-2 | 0.33-2 | 0.33-2 | 0.33-2 | 0.33-2 |
Rigid finished copper | oZ | 0.5-4 | 0.33-4 | 0.33-4 | 0.33-4 | 0.33-4 | 0.33-4 |
Min trace width/distance | mm | 0.075/0.075 | 0.06/0.06 | 0.05/0.05 | 0.05/0.05 | 0.05/0.05 | 0.04/0.04 |
Min thickness | mm | 0.35 | 0.3 | 0.3 | 0.25 | 0.25 | 0.25 |
Impedance | % | ±10 | ±10 | ±8 | ±7 | ±7 | ±5 |
Warping | % | ≤0.75 | ≤0.50 | ≤0.75 | ≤0.50 | ≤0.50 | ≤0.50 |
Min finished PTH | mm | 0.15 | 0.1 | 0.15 | 0.1 | 0.1 | 0.1 |
Depth milling | mm | ±0.075 | ±0.075 | ±0.075 | ±0.075 | ±0.075 | ±0.075 |
HDI-RF laser step | / | 2step | 3step | 2step | 3step | 3step | 3step |
FLEX quantity (hinge) | / | ≤4 | ≤6 | ≤6 | ≤8 | ≤8 | ≤10 |
FLEX quantity(bonding) | / | ≤2 | ≤2 | ≤2 | ≤2 | ≤2 | ≤2 |