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The mobile Internet application field is accelerating the iteration of intelligent mobile terminal products, such as smart phones, tablets, smart watches, and wearable devices. The products are gradually developing towards lighter, thinner, and more intelligent application directions, which have put forward higher requirements for display technology and data transmission and processing capabilities. The diversification of uses and the light - weight and thin - volume of products also prompt the printed circuit boards to arrange more wires within a limited area and continuously develop in the ultra - fine - grained directions such as narrower line width, denser wiring, and more precise processes. PCB MASTER has rich experience in the research and development and production of HDI products. HDI circuit boards have achieved large-scale mass production for interconnection products from 1st order to any order, and they are mainly applied to products such as mobile phones, tablets, and wearable devices.

HDI PCB-Automobile technical capability
Items		2024		2025		2026
Items		volume	sample	volume	sample	volume	sample
Layer count		≤24L	≤36L	≤24L	≤36L	≤24L	≤36L
Stack-up		3+N+3	4+N+4	4+N+4	Anylayer(10L)	Anylayer(10L)	Anylayer(12L)
Dimension(mm)	MAX	620*725mm	620*810mm	620*725mm	620*1092mm	620*725mm	620*1092mm
Board thickness(mm)	MAX	3.2mm	4.2mm	3.2mm	4.2mm	3.2mm	4.2mm
lmpedance tolerance	Diff>50ohm	土10%	土7%	土10%	土7%	土8%	土7%
lmpedance tolerance	single 50ohm	土10%	土8%	土8%	土6%	土8%	土6%
Layer registration	≤12L	≥5mil	≥4mil	≥5mil	≥4mil	≥4mil	≥3mil
	>12L	≥7mil	≥5mil	≥6mil	≥5mil	≥5mil	≥4mil
	N+N	≥7mil	≥5mil	≥7mil	≥5mil	≥5mil	≥4mil
Pattern accuracy	≤500mm	±4mil	±4mil	±4mil	±4mil	±4mil	±4mil
Pattern accuracy	>500mm	±5mil	±5mil	±5mil	±5mil	±5mil	±5mil
Laser blind hole		100/225um	75/200um	75/200um	75/180um	75/180um	65/165um
Dimple		25um	15um	20um	10um	20um	10um
Plating aspect ratio for via hole		14:1	16:1	14:1	16:1	14:1	16:1
Back- drill	Back-drill size (min)	0.45mm	0.4mm	0.45mm	0.4mm	0.4mm	0.35mm
	STUB (min)	8mil	6mil	8mil	6mil	6mil	5mil
	Back-drill to copperdistance (min)	7mil	5mil	7mil	5mil	5mil	5mil
Special technology	POFV	yes	yes	yes	yes	yes	yes
	N+N	yes	yes	yes	yes	yes	yes
	Hybrid lamination	yes	yes	yes	yes	yes	yes
	Blind hole	yes	yes	yes	yes	yes	yes
	Metallized half hole	yes	yes	yes	yes	yes	yes

FLEX technical capability
Items		2024		2025		2026		remark
		volume	sample	volume	sample	volume	sample
Material	Flexible substrate	Non-adhesive substrate, adhesive substrate、LCP		Non-adhesive substrate, adhesive substrate、LCP		Non-adhesive substrate, adhesive substrate、LCP
	Stiffener	PI、FR4、 steel、Aluminium		PI、FR4、 steel、Aluminium		PI、FR4、 steel、Aluminium
	PP	Epoxy glue, acrylic glue		Epoxy glue, acrylic glue		Epoxy glue, acrylic glue
	Covering film	Epoxy glue, acrylic glue		Epoxy glue, acrylic glue		Epoxy glue, acrylic glue
Layers	Flexible	4L		6L		8L
Thickness	Finished	Min 0.03mm		Min 0.03mm		Min 0.03mm		1L FLEX
	Tolerance	Min ±0.015mm		Min ±0.015mm		Min ±0.015mm
Finished copper	Inner copper	1/3-1oZ		1/3-2oZ		1/3-2oZ		Base copper thickness
	Outer copper	1/3-2oZ		1/3-3oZ		1/3-3oZ		Base copper thickness
Dimension	Min	20mm*20mm		10mm*10mm		5mm*5mm
	Max	500mm*610mm		500mm*610mm		500mm*610mm
Trace width/distance	Inner layer	2mil/2mil		2mil/2mil		1.8mil/1.8mil		Finished copper 0.5oZ
	Outer layer	2mil/2mil		2mil/2mil		1.8mil/1.8mil		Finished copper 1oZ
Finished hole	Drilling	Min 0.1mm		Min 0.1mm		Min 0.1mm
	Laser drilling	Min 0.075mm		Min 0.075mm		Min 0.05mm
Thickness to diameter	Drilling	Max 1:1		Max 1:1		Max 1:1
	Laser drilling	Max 12:1		Max 15:1		Max 15:1
Dielectric thickness	Flexible core	Min 0.0125mm		Min 0.0125mm		Min 0.0125mm
Dimensional tolerance	Laser cutting	±0.05mm		±0.05mm		±0.05mm		UV Laser cutting
	Die-cutting	Min 0.05mm		Min 0.05mm		Min 0.05mm		Slow wire die cutting

Rigid-FLEX technical capability
Items	units	2024		2025		2026
Items	units	volume	sample	volume	sample	volume	sample
Medium thickness(FLEX )	mm	0.025~0.10	0.025~0.15	0.025~0.15	0.013~0.15	0.013~0.15	0.013~0.15
Surface smoothness	um	50	50	50	30	30	30
Min distance hole to Window	mm	0.8	0.5	0.5	0.4	0.4	0.4
Min distance trace to Window	mm	0.4	0.2	0.2	0.2	0.2	0.2
Window Excess glue	mm	1.00	0.5	0.5	0.3	0.3	0.3
Min window width	mm	3.5	3	3	2.6	2.6	2.6
FLEX finished copper	oZ	0.5-2	0.5-2	0.33-2	0.33-2	0.33-2	0.33-2
Rigid finished copper	oZ	0.5-4	0.33-4	0.33-4	0.33-4	0.33-4	0.33-4
Min trace width/distance	mm	0.075/0.075	0.06/0.06	0.05/0.05	0.05/0.05	0.05/0.05	0.04/0.04
Min thickness	mm	0.35	0.3	0.3	0.25	0.25	0.25
Impedance	%	±10	±10	±8	±7	±7	±5
Warping	%	≤0.75	≤0.50	≤0.75	≤0.50	≤0.50	≤0.50
Min finished PTH	mm	0.15	0.1	0.15	0.1	0.1	0.1
Depth milling	mm	±0.075	±0.075	±0.075	±0.075	±0.075	±0.075
HDI-RF laser step	/	2step	3step	2step	3step	3step	3step
FLEX quantity (hinge)	/	≤4	≤6	≤6	≤8	≤8	≤10
FLEX quantity(bonding)	/	≤2	≤2	≤2	≤2	≤2	≤2

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