PCBMASTER | pcbmaster

PCB technology also plays an important role in medical treatment. For example, high-precision medical equipment such as electroencephalogram monitoring and magnetic resonance imaging requires high-density and high-performance PCBs to achieve accurate data transmission and processing. In addition, more and more miniature medical electronic devices have begun to be applied in fields such as drug release and disease diagnosis. These miniature devices also rely on PCB technology to fulfill their functions. This has put forward higher requirements for PCB research and development as well as manufacturing technologies. Higher-density and higher-performance PCBs are needed to achieve high-speed data transmission and processing. With many years of experience in the flexible manufacturing of high-reliability and high-stability PCB products, PCB MASTER focuses on the development, manufacturing and sales of high-density multi-layer PCB, HDI, rigid and flexible PCB products, and serves many medical electronics customers at home and abroad, and has been recognized and trusted by customers for a long time.

PCB-medical technical capability
Items		2024		2025		2026
Items		volume	sample	volume	sample	volume	sample
Layer count		≤24L	≤36L	≤24L	≤36L	≤24L	≤36L
Dimension(mm)	Max	580*850mm	580*1100mm	580*1100mm	580*1100mm	580*1100mm	580*1100mm
Board thickness(mm)	Max	5mm	8mm	6mm	6mm	6mm	10mm
Min/Max copper thickness (OZ)		0.5/6	0.5/6	0.5/6	0.5/6	0.5/6	0.5/6
Layer registration(mm)		0.100	0.089	0.089	0.089	0.089	0.089
Back drill Stub(mm)		0.15±0.10	0.125±0.075	0.15±0.10	0.125±0.075	0.125±0.075	0.125±0.075
Aspect ratio	Drill size 0.15mm	16:1	20:1	16:1	20:1	18:1	23:1
	Drill size 0.20mm	20:1	23:1	20:1	23:1	23:1	25:1
	Laser drill size 0.2mm	1:1	1:1	1:1	1.2:1	1.2:1	1.2:1
lmpedance tolerance	Inner	±8%	±5%	±7%	±5%	±7%	±5%
lmpedance tolerance	Outer	±9%	±8%	±8%	±8%	±8%	±7%
Inner Min. line width/space	Copper thickness 0.5oZ (um)	76/76	66/76	76/76	66/76	76/76	66/76
Inner Min. line width/space	Copper thickness 1.0oZ (um)	76/89	76/76	76/89	76/76	76/89	76/76
Outer Min. line width/space	Finish copper thickness 38-48um(um)	89/89	76/89	76/89	76/76	76/76	76/76
Outer Min. line width/space	Finish copper thickness 48-58um(um)	100/100	89/100	89/100	89/89	89/89	89/89
Resin plug hole	Min plug hole size(mm)	0.2	0.15	0.2	0.15	0.15	0.15
Solder mask	Solder mask registration (um)	±35	±25	±25	±25	±25	±25
	Min solder mask bright (mm)	0.075	0.064	0.075	0.05	0.064	0.05
	Max plug aspect ratio	12:1	14:1	14:1	16:1	14:1	16:1
Special technology	POFV	yes	yes	yes	yes	yes	yes
Special technology	N+N	yes	yes	yes	yes	yes	yes

FLEX technical capability
Items		2024		2025		2026		remark
		volume	sample	volume	sample	volume	sample
Material	Flexible substrate	Non-adhesive substrate, adhesive substrate、LCP		Non-adhesive substrate, adhesive substrate、LCP		Non-adhesive substrate, adhesive substrate、LCP
	Stiffener	PI、FR4、 steel、Aluminium		PI、FR4、 steel、Aluminium		PI、FR4、 steel、Aluminium
	PP	Epoxy glue, acrylic glue		Epoxy glue, acrylic glue		Epoxy glue, acrylic glue
	Covering film	Epoxy glue, acrylic glue		Epoxy glue, acrylic glue		Epoxy glue, acrylic glue
Layers	Flexible	4L		6L		8L
Thickness	Finished	Min 0.03mm		Min 0.03mm		Min 0.03mm		1L FLEX
	Tolerance	Min ±0.015mm		Min ±0.015mm		Min ±0.015mm
Finished copper	Inner copper	1/3-1oZ		1/3-2oZ		1/3-2oZ		Base copper thickness
	Outer copper	1/3-2oZ		1/3-3oZ		1/3-3oZ		Base copper thickness
Dimension	Min	20mm*20mm		10mm*10mm		5mm*5mm
	Max	500mm*610mm		500mm*610mm		500mm*610mm
Trace width/distance	Inner layer	2mil/2mil		2mil/2mil		1.8mil/1.8mil		Finished copper 0.5oZ
	Outer layer	2mil/2mil		2mil/2mil		1.8mil/1.8mil		Finished copper 1oZ
Finished hole	Drilling	Min 0.1mm		Min 0.1mm		Min 0.1mm
	Laser drilling	Min 0.075mm		Min 0.075mm		Min 0.05mm
Thickness to diameter	Drilling	Max 1:1		Max 1:1		Max 1:1
	Laser drilling	Max 12:1		Max 15:1		Max 15:1
Dielectric thickness	Flexible core	Min 0.0125mm		Min 0.0125mm		Min 0.0125mm
Dimensional tolerance	Laser cutting	±0.05mm		±0.05mm		±0.05mm		UV Laser cutting
	Die-cutting	Min 0.05mm		Min 0.05mm		Min 0.05mm		Slow wire die cutting

Rigid-FLEX technical capability
Items	units	2024		2025		2026
Items	units	volume	sample	volume	sample	volume	sample
Medium thickness(FLEX )	mm	0.025~0.10	0.025~0.15	0.025~0.15	0.013~0.15	0.013~0.15	0.013~0.15
Surface smoothness	um	50	50	50	30	30	30
Min distance hole to Window	mm	0.8	0.5	0.5	0.4	0.4	0.4
Min distance trace to Window	mm	0.4	0.2	0.2	0.2	0.2	0.2
Window Excess glue	mm	1.00	0.5	0.5	0.3	0.3	0.3
Min window width	mm	3.5	3	3	2.6	2.6	2.6
FLEX finished copper	oZ	0.5-2	0.5-2	0.33-2	0.33-2	0.33-2	0.33-2
Rigid finished copper	oZ	0.5-4	0.33-4	0.33-4	0.33-4	0.33-4	0.33-4
Min trace width/distance	mm	0.075/0.075	0.06/0.06	0.05/0.05	0.05/0.05	0.05/0.05	0.04/0.04
Min thickness	mm	0.35	0.3	0.3	0.25	0.25	0.25
Impedance	%	±10	±10	±8	±7	±7	±5
Warping	%	≤0.75	≤0.50	≤0.75	≤0.50	≤0.50	≤0.50
Min finished PTH	mm	0.15	0.1	0.15	0.1	0.1	0.1
Depth milling	mm	±0.075	±0.075	±0.075	±0.075	±0.075	±0.075
HDI-RF laser step	/	2step	3step	2step	3step	3step	3step
FLEX quantity (hinge)	/	≤4	≤6	≤6	≤8	≤8	≤10
FLEX quantity(bonding)	/	≤2	≤2	≤2	≤2	≤2	≤2

Leave a Message

LED

Computer

Mobile Phone

Industrial Control

Server

Security

Photovoltaic

Medical

Automotive

Communications

How to order