FPC/Flex PCB specification parameters
X mm
pcs
Total layers
Flex part layers
Total board thickness
Flex part thickness
Rigid part copper
Flex part copper

Process Options

Immersion gold(ENIG)
OSP
Immersion silver(Ag)
Hard gold
Immersion tin
Immersion Nickel-plated gold
Immersion gold + Selective Hard gold

Advanced Options

HDI-Buried/blind vias
Customer stackup
RF Material+FR-4 mixed stackup
Impedance control
Half-cut/Castellated Holes
Edge Plating
Gold finger
Drill-step Deep Control
Back drill deep control
Buried and embedded copper block
Buried resistance-capacitance
Print serial number
Peelable soldermask
Thermoelectric heat dissipation
Insulation for plug-in components
Copper-Aluminum mixed
Aluminum-based superconductors
Copper-based superconductors
Via filled with resin
Via filled with copper paste
Plated Via plugging
Via in pad
Circuit rework unacceptable
Hole copper thickness≧25UM
Countersinks/Counterbores
Gold Plating for Leadless PCB
Precision routing±0.05mm
Confirm work file

Customized Options

PCB Assembly Service

The above - mentioned PCBs require PCB assembly

PCB Build Time
PCB Fee
Please fill in the parameters first
country flag
express type

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