HDI-Buried/blind vias

Customer stackup

RF Material+FR-4 mixed stackup

Impedance control

Half-cut/Castellated Holes

Edge Plating

Gold finger

Drill-step Deep Control

Back drill deep control

Buried and embedded copper block

Buried resistance-capacitance

Print serial number

Peelable soldermask

Thermoelectric heat dissipation

Insulation for plug-in components

Copper-Aluminum mixed

Aluminum-based superconductors

Copper-based superconductors

Via filled with resin

Via filled with copper paste

Plated Via plugging

Via in pad

Circuit rework unacceptable

Hole copper thickness≧25UM

Countersinks/Counterbores

Gold Plating for Leadless PCB

Precision routing±0.05mm

Confirm work file

Service d 'assemblage de PCB