PCBMASTER

Manière de panneau:

Taille (simple):

X mm

Options de processus

Type de feuille de cuivre:

Couverture:

Sérigraphie:

Finition de surface:

Immersion gold(ENIG)

OSP

Immersion silver(Ag)

Hard gold

Immersion tin

Immersion Nickel-plated gold

Immersion gold + Selective Hard gold

Via le processus:

Renfort:

Raidisseur TOP:

PI Stiffener

0,0275mm

0,05 mm

0,075 mm

0,1 mm

0,15 mm

0,175 mm

0,2 mm

0.225mm

0,25 mm

0,3 mm

FR-4 Stiffener

0,2 mm

0,3 mm

0,4 mm

0,5 mm

0,6 mm

0,7 mm

0,8 mm

0,9 mm

1,0 mm

1.1mm

1.2mm

1,3 mm

1,4 mm

1,5 mm

Steel Sheet Stiffener

Aluminum Stiffener

0,2 mm

0,4 mm

0,6 mm

0,8 mm

1,0 mm

1.2mm

1,5 mm

Black FR-4 Stiffener

0,2 mm

0,3 mm

0,4 mm

0,5 mm

0,6 mm

0,7 mm

0,8 mm

0,9 mm

1,0 mm

1.1mm

1.2mm

1,3 mm

1,4 mm

1,5 mm

Raidisseur BOT:

PI Stiffener

0,0275mm

0,05 mm

0,075 mm

0,1 mm

0,15 mm

0,175 mm

0,2 mm

0.225mm

0,25 mm

0,3 mm

FR-4 Stiffener

0,2 mm

0,3 mm

0,4 mm

0,5 mm

0,6 mm

0,7 mm

0,8 mm

0,9 mm

1,0 mm

1.1mm

1.2mm

1,3 mm

1,4 mm

1,5 mm

Steel Sheet Stiffener

Aluminum Stiffener

0,2 mm

0,4 mm

0,6 mm

0,8 mm

1,0 mm

1.2mm

1,5 mm

Black FR-4 Stiffener

0,2 mm

0,3 mm

0,4 mm

0,5 mm

0,6 mm

0,7 mm

0,8 mm

0,9 mm

1,0 mm

1.1mm

1.2mm

1,3 mm

1,4 mm

1,5 mm

Film de blindage EMI:

Ruban 3M / Tesa:

Ruban conducteur double face:

Options avancées

HDI-Buried/blind vias

Customer stackup

RF Material+FR-4 mixed stackup

Impedance control

Half-cut/Castellated Holes

Edge Plating

Gold finger

Drill-step Deep Control

Back drill deep control

Buried and embedded copper block

Buried resistance-capacitance

Print serial number

Peelable soldermask

Thermoelectric heat dissipation

Insulation for plug-in components

Copper-Aluminum mixed

Aluminum-based superconductors

Copper-based superconductors

Via filled with resin

Via filled with copper paste

Plated Via plugging

Via in pad

Circuit rework unacceptable

Hole copper thickness≧25UM

Countersinks/Counterbores

Gold Plating for Leadless PCB

Precision routing±0.05mm

Confirm work file

Options personnalisées

Marque UL:

Rapport d 'expédition:

Ajouter ou mettre à jour le code de date:

Exigences d 'emballage:

Modèle de client / matériel / numéro d 'ordre:

Other parameters

Processing Requirement:

BONDING

Press-Fit

Types of SMD materials:

Number of SMD Parts:

Types of Through-Hole materials:

Number of Through-Hole Parts:

PCBA Property:

SMD stencil shipped with the order

Line/Pad Add Tinning

Plated Through-Hole (PTH) Fill

Thermal conductive adhesive

Conformal coating

Electronic device baking

Function test

Program burning

Assembly side(s):

PCB type:

Process requirements:

PCB assembly first piece confirm:

Options de processus

Options avancées

Options personnalisées

Service d 'assemblage de PCB

Other parameters

Upload Files

Please upload your PCB design file.

If you need assembly service, upload BOM and coordinate files also.

New Registrant

Submitting Successful

Options de processus

Options avancées

Options personnalisées

Service d 'assemblage de PCB

Other parameters

Upload Files

Please upload your PCB design file. If you need assembly service, upload BOM and coordinate files also.

New Registrant

Submitting Successful

Please upload your PCB design file.

If you need assembly service, upload BOM and coordinate files also.