1.Material:

Typically flexible films (like PI or PET) coated with Pressure-Sensitive Adhesive (PSA) or thermosetting adhesive, or specially formulated cured adhesives. Adhesive systems are selected to ensure proper bonding of polymer layers in adhesive stiffeners.

2.Forms:

• Adhesive Film (with liner): Like double-sided tape; PI or PET film coated with adhesive on one or both sides. These are often produced as a thin film layer to achieve the desired thickness.
• Liquid/Paste Reinforcement Adhesive: Applied via dispensing, printing, or pressing, then cured.

Layer stiffeners can be applied to specific layers of the FPC using adhesive systems.

3.Advantages:

• Thin & Uniform: Achieves very thin stiffening (common: 0.05mm - 0.2mm).
• Good Flexibility: Inherently flexible; combined FPC maintains relatively good dynamic bend performance.
• Simple Processing: Lamination process is straightforward (like applying a label), no high temp/pressure needed. Adhesive stiffeners are commonly used to attach PCB stiffeners during the assembly process, and thermal bonding can be used for more permanent attachment.
• Lower Cost: Generally lower material and processing cost compared to PI/FR-4.
• Good Insulation: Base material is insulating.

4.Disadvantages:

• Limited Rigidity: Provides the weakest support; unsuitable for high-strength needs (large/heavy connectors).
• Moderate Temperature Resistance: Depends on base/adhesive. PSA may soften/fail under sustained heat; thermosetting types need careful evaluation of cure temp and long-term thermal stability.
• Long-Term Reliability: Requires careful selection for adhesive aging resistance, chemical resistance, and anti-creep properties.

5.Typical Applications:

Light-load connectors, backing for gold fingers, areas needing slight support with some bend allowance, cost-sensitive consumer electronics.

1.Material:

Traditional rigid PCB substrate (glass fiber reinforced epoxy laminate). FR-4 is composed of woven glass fiber laminate and epoxy resin, providing excellent insulation and durability.

Form:

Cut sheets (common thicknesses: 0.1mm, 0.2mm, 0.3mm, 0.4mm). FR-4 stiffeners are available in different thicknesses, and selecting the appropriate stiffener thickness is crucial to provide mechanical support for the application.

2.Advantages:

• Excellent Rigidity: Provides very high local rigidity and strong support. FR-4 stiffeners are commonly used in printed circuit board and circuit board applications to provide mechanical support.
• High Temperature Resistance: High Tg (typically >130°C, high-Tg >170°C+), withstands lead-free soldering temps (260°C+ peak). FR-4 stiffeners are ideal for use in reflow processes, maintaining alignment and preventing warping.
• Good Dimensional Stability: Relatively low and controlled CTE.
• Mature Process Compatibility: Bonds reliably to FPC via high-temp lamination (using adhesive films like PI/epoxy glue), strong adhesion.
• Good Insulation: Excellent insulator.

3.Disadvantages:

• Thick & Stiff: Requires greater thickness than other materials for equivalent rigidity, making the area very stiff and non-bendable, impacting overall FPC flexibility.
• Higher Cost: Material and processing (lamination) costs are higher than PET/adhesive.
• Heavier Weight: Glass fiber adds weight compared to PI/PET/adhesive.

4.Typical Applications:

Areas needing strong support: high-current/multi-pin connector solder joints, through-hole component areas, FPC ends acting as rigid “boards” for insertion/removal. FR-4 stiffeners are often used in rigid flex circuits and rigid flex PCBs, especially in areas with plated through holes, where stiffeners are placed on the same side as the components to ensure access to solder pads. Proper stiffener placement is essential for supporting project assembly and ensuring reliable solder joints.

1. Material:

This section discusses stainless steel stiffeners, typically made from 304 stainless steel sheet. Stainless steel stiffeners are widely used in flexible circuit designs to provide enhanced mechanical support and durability.

2. Form:

Precision stamped or etched thin sheets (common: 0.1mm, 0.15mm, 0.2mm).

3. Advantages:

• Exceptional Rigidity & Strength: Provides far superior rigidity and crush/impact resistance than FR-4/PI/PET at very thin gauges.
• Abrasion Resistance & Component Protection: Stainless steel stiffeners offer excellent abrasion resistance, helping to protect components in high-stress areas or flex zones from wear and mechanical damage.
• Outstanding Temperature Resistance: Easily withstands soldering temps (>300°C) without degradation.
• EMI Shielding (Optional): Can provide local EMI shielding if properly grounded.
• Dimensional Stability: Low metal CTE.

4. Disadvantages:

• Conductivity: Major drawback! Requires absolute electrical isolation from FPC conductors (using insulating adhesive films, strict edge burr/stamp control). High risk of shorts if not managed perfectly. While stainless steel stiffeners are not an electrical piece, they must be electrically isolated from the circuit to prevent unintended conductivity.
• Heaviest Weight: Significantly denser than other materials.
• Highest Cost: Material (stainless) and processing (precision stamping/etching) costs are typically highest.
• Non-Bendable: Area becomes completely rigid.

5. Typical Applications:

Stainless steel stiffeners are commonly used in flexible circuits, especially in areas requiring reinforcement beyond what woven glass fiber laminate can provide. Typical uses include areas needing extreme mechanical support/crush resistance (e.g., under SIM/SD card sockets), reinforcement for ultra-thin connectors, and flex zones where additional support is needed to protect components or connectors from bending and mechanical stress, as well as areas needing local EMI shielding. Critical: Requires rigorous insulation design!

1.Material:

Polyethylene Terephthalate film.

2.Form:

Film with PSA or thermoset adhesive, or bare film laminated via adhesive film.

3.Advantages:

• Lowest Cost: Most cost-effective material among common stiffeners.
• Good Flexibility: Softer than PI, good for dynamic bending. PET is often used as a flex material in flexible PCBs and flex PCBs, providing support without compromising signal integrity.
• Good Insulation.
• Relatively simple processing (especially PSA types).

4.Disadvantages:

• Poor Temperature Resistance: Major limitation. Low Tg (~70°C-80°C), melts around 250°C. Severely deforms, shrinks, or melts during soldering (especially lead-free reflow ~260°C peak), causing FPC warping, component misalignment, and solder defects. Generally unsuitable for SMT soldering areas!
• Low Rigidity: Provides minimal support strength.
• Poor Dimensional Stability: Prone to thermal deformation/shrinkage.

5.Typical Applications:

Only for non-soldering areas with low thermal demands: backing to prevent over-bending, support under tactile switches, low-cost non-critical reinforcement. Strictly avoid near soldering areas!

1.Material:

Polyimide films (e.g., Kapton), same as FPC base material, are used to make PI stiffeners.

2.Form:

Film with adhesive (often PSA or acrylic - “PI Stiffener”), or bare PI sheet laminated via PI adhesive under heat/pressure.

3.Advantages:

• Exceptional Temperature Resistance: Tg > 250°C, continuous use >200°C, withstands soldering peaks (300°C+). Key advantage. Polyimide films also provide excellent solder resistance, ensuring durability and reliability during soldering processes.
• Good Rigidity-Flexibility Balance: Thinner and more flexible than FR-4, more rigid than PET. Provides sufficient soldering support while allowing flexibility elsewhere.
• Good Dimensional Stability: Low CTE, minimal dimensional change at high temp.
• Excellent Insulation. PI stiffeners can also serve as a solder resist layer, protecting solder joints from abrasion and damage.
• High Compatibility with FPC: Good CTE match; forms strong, reliable thermal bonds.

4.Disadvantages:

• High Cost: Material cost second only to steel, significantly higher than PET/adhesive.
• Moisture Absorption: PI absorbs some moisture, requiring baking before soldering to prevent potential “popcorning”.

5.Typical Applications:

Primary choice for areas needing soldering resistance combined with flexibility/thinness. Widely used under SMT components, connectors/gold fingers, areas needing repeated bends with local support. PI stiffeners are commonly used in ZIF connector areas and as top layer stiffeners to provide uniform support. Maintaining the same stiffener thickness across multiple stiffeners is important for consistent performance and structural integrity. A mainstream material for high-performance FPC.

1.Material:

Aluminum alloy sheet (e.g., 5052).

2.Form:

Cut or etched sheets, available in different thickness to suit various applications.

3.Advantages:

• Good Rigidity & Strength: Better than FR-4/PI/PET, less than steel. Aluminum is often used as a PCB stiffener to provide mechanical support.
• Excellent Thermal Conductivity: Key advantage! Enables local heat dissipation (e.g., under LED strips, power components).
• Lightweight: Lower density than steel.
• Relatively Lower Cost (vs. Steel/PI).
• Good Machinability: Easy to cut/stamp.
• Thermal bonding can be used to attach aluminum stiffeners for a durable connection.

4.Disadvantages:

• Conductivity: Like steel, requires strict electrical isolation to prevent shorts. Proper insulation is required to prevent interference with electrical connections. Design/process risk.
• Moderate Temperature Resistance: Strength decreases above ~150°C; soldering heat may cause oxidation/discoloration but withstands peak temps (melting point >600°C).
• Adhesive Compatibility: Surface oxide layer and thermal conductivity can affect bond reliability with some adhesives.

5.Typical Applications:

Primarily for FPC areas needing local heat spreading (e.g., LED lighting strips, under small power devices like MOSFETs/Driver ICs). Also used where good rigidity + heat dissipation is needed, away from conductive sensitive areas. Requires strict insulation design!