Parámetros de especificación de PCB FPC/Flex
X mm
pcs

Opciones de proceso

Immersion gold(ENIG)
OSP
Immersion silver(Ag)
Hard gold
Immersion tin
Immersion Nickel-plated gold
Immersion gold + Selective Hard gold

Opciones avanzadas

HDI-Buried/blind vias
Customer stackup
RF Material+FR-4 mixed stackup
Impedance control
Half-cut/Castellated Holes
Edge Plating
Gold finger
Drill-step Deep Control
Back drill deep control
Buried and embedded copper block
Buried resistance-capacitance
Print serial number
Peelable soldermask
Thermoelectric heat dissipation
Insulation for plug-in components
Copper-Aluminum mixed
Aluminum-based superconductors
Copper-based superconductors
Via filled with resin
Via filled with copper paste
Plated Via plugging
Via in pad
Circuit rework unacceptable
Hole copper thickness≧25UM
Countersinks/Counterbores
Gold Plating for Leadless PCB
Precision routing±0.05mm
Confirm work file

Opciones personalizadas

Servicio de montaje del PCB

Los PCB antes mencionados requieren el montaje de PCB

Tiempo de construcción de PCB
Cuota de PCB
Por favor, rellene los parámetros primero
country flag
express type

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