Thermoelectric Separation Copper and aluminum mixed base PCB
Product Specifications
- Material Copper and aluminum mixed
- Layer 1
- Thickness 2.0mm
- Thermal conductivity 2W/mK
- Dielectric thickness 4mil
- Special technology copper and aluminum mixed.Thermoelectric Separation
Related Products
Ready to start your project?
Get a quote today or contact our technical team for assistance.