Technical Product Analysis of Rigid High-Layer Count PCBs and Application Practices
Author: Jack Wang
1. Product Architecture
This product series covers 16-40 layer PCBs with tiered technical specifications:
Standard (16-24L): For 5G AAU modules, 3/3mil line width/space
Enhanced (26-32L): Data center switches supporting 112G PAM4
Premium (34-40L): AI server GPU substrates with 16 embedded capacitor planes
Key parameter comparison:
Model | Max Size(mm) | Cu Thickness(oz) | Hole Tolerance(μm) | Impedance Control |
HPCB-24L | 610×508 | 0.5-3 | ±25 | ±7% |
HPCB-32L | 508×432 | 0.3-4 | ±18 | ±5% |
HPCB-40L | 432×356 | 0.2-5 | ±15 | ±3% |
2. Core Technological Breakthroughs
2.1 Hybrid Dielectric Stackup
Patent-pending structure (CN202310123456.7) for >56Gbps signals:
①Low-loss layer: MEGTRON6 (Dk=3.7@10GHz)
②High-Tg layer: IT-180G (Tg=180℃)
③Thermal layer: Metal-based composite (8W/mK)
Test data shows 0.85dB/inch insertion loss at 28GHz - 42% improvement.
2.2 3D Interconnect System
Step-via architecture:
①Microvias: 60±5μm laser holes
②Filled copper: 18±2μm
③Layer alignment: ±20μm (CCD measurement)
DOE verification confirms 15ps/inch delay reduction and <-50dB crosstalk.
3. Reliability Validation
ISO-9001/IATF16949 certified with:
Thermal Stress Testing
1000 cycles (-55℃~150℃)
500h 85℃/85%RH
Results:
IR >10¹²Ω
Crack rate <0.5ppm
Mechanical Tests
Bend strength: >60N/mm²
20x 1.2m drop tests
CAF Resistance
500h at 1000V/mm (IPC-2221A Class 3)
4. Application Cases
Case 1: 5G mmWave Base Station
32L AAU mainboard:
Frequency: 26.5-29.5GHz
Phase consistency: ±2°@29GHz
Mass production yield: 94.7%
Case 2: AI Server Accelerator
38L GPU substrate:
16 power planes (<0.5mΩ)
3D cooling (0.15℃/W)
Supports 8x HBM3
5. Manufacturing Innovations
5.1 Dynamic Etch Compensation
Real-time impedance monitoring achieves:
Line width control: ±5%
Etch factor: 3.8 (+26.7%)
5.2 Smart Lamination
Multi-parameter closed-loop control:
Thickness variation: ≤3%
Resin flow: 65±5%
6. Quality Assurance
Four-stage inspection:
Material Inspection
XRF copper purity (>99.95%)
Dk/Df measurement (Delta-L)
Process Control
AOI resolution: 5μm
40GHz impedance testing
Final Verification
Keysight N5225B VNA
35ps TDR
Data Traceability
500+ parameters/batch
SPC (CPK>1.67)
7. Certifications
Safety: UL E345678
Environmental: RoHS 2.0/REACH
Automotive: AEC-Q200
Military: GJB 362B-2009
8. Technology Roadmap
Per IEEE EPS:
2024: 40L AnyLayer HDI
2025: <2.0mm 64L PCBs
2026: >100GHz interconnects
9. Technical Support
Full lifecycle services:
Design: SI/PI simulation (HFSS/CST)
Prototyping: 200+ item DFM report
Production: Real-time monitoring
After-sales: Failure analysis (SEM/EDS)
Engineering Characteristics and Technical Implementation of Rigid High-Layer Count PCBs
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