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High - Layer Multilayer PCB
HDI PCB
HF&HS PCB
FPC&HDI FPC
Rigid-Flex Board
Metal Base-PCB
Alumina&AlN Ceramic-PCB
Mini LED Light-PCB
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2 Layer 0.20mm ultrathin-PCB
Material：
FR-4 S1000-H
Layer：
2
Thickness：
0.2mm
Surface finish：
Immersion gold（ENIG）
Min Track/Spacing：
3/3mil
Special technology：
ultrathin-rigid material，Quality control
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8 Layer HDI（3-Level）-Stepped PCB
Material：
FR-4 S1000-2M
Layer：
8
Thickness：
1.6mm
Surface finish：
Immersion gold（ENIG）
Min Track/Spacing：
2.5/2.5mil
Min Hole size：
CNC 0.15mm/Laser 0.10mm
Special technology：
HDI (3-Level)
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22-layer stepped gold fingers-PCB
Material：
TU-872SLK
Layer：
22
Thickness：
3.0mm
Surface finish：
Immersion gold+plating hard gold
Min Track/Spacing：
3/3mil
Min Hole size：
0.2mm
Special technology：
stepped gold fingers
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8 Layer-BGA Substrate PCB
Material：
SH260 TG250
Layer：
8
Thickness：
2.0mm
Surface finish：
Nickel-Palladium-Gold
Min Track/Spacing：
2.5/2.5mil
Min Hole size：
0.15
Special technology：
Via filled with resin+plating filling .Little line spacing.
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6Layer Heavy copper -Power Supply PCB
Material：
FR-4 S1000-2M
Layer：
6
Thickness：
1.8mm
Surface finish：
Immersion gold（ENIG）
Min Track/Spacing：
6/6mil
Min hole size：
0.3mm
Special technology：
Heavy copper thickness：3oZ .Little line spacing.
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4Layer Depth-controlled plating stepped-PCB
Material：
FR-4 TG150
Layer：
4
Thickness：
1.6mm
Surface finish：
Nickel-Palladium-Gold
Min Track/Spacing：
3/3mil
Min Hole size：
0.2mm
Special technology：
Depth-controlled plating stepped.IC bonding
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4 Layer 0.30mm limit Half-cut-PCB
Material：
FR-4 TG150
Layer：
4
Thickness：
0.8mm
Surface finish：
Immersion gold（ENIG）
Min Track/Spacing：
3.5/3.5mil
Min Hole size：
0.2mm
Special technology：
limit Half-cut
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