8 Layer HDI Rigid-Flex PCB
Product Specifications
- Material S1000-2M+ Polyimide（SY）
- Layer 8L(2R+4F+2R)
- Thickness 1.03mm 土10%
- Min Track/spacing 0.076 / 0.1mm
- Min hole size 0.10mm
- Surface finish Immersion gold(ENIG)
- Special technology 2-Level HDI.Multi - Layered Laser Decapping.HI-POT
Related Products
Ready to start your project?
Get a quote today or contact our technical team for assistance.