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IC Packaging Products

PCBMASTER creates special-type PCBs tailored to unique application needs, including odd-shaped, high-reliability and application-specific printed circuit boards.

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Memory Card IC Substrate

Material: BT Layer: 2 layer Thickness: 0.2mm

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CSP IC Substrate

Material: BT Layer: 2 layer Thickness: 0.2mm

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SiP IC Substrate

Material: BT Layer: 2 layer Thickness: 0.25mm

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6L（2-Level）IC packaging

Material: BT Layer: 6Layer（2-Level） Thickness: 0.35mm

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4L（1-Level）IC packaging

Material: BT Layer: 4Layer（1-Level） Thickness: 0.25mm

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2-layer IC packaging substrate

Material: BT Layer: 2-layer Thickness: 0.3mm

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