4L（1-Level）IC packaging

Product Specifications

• Material BT
• Layer 4Layer（1-Level）
• Thickness 0.25mm
• Surface finish Electroless Nickel - Palladium - Gold: Nickel thickness 120 - 240U, Palladium thickness: 2U, Gold thickness: 2U
• Min Track/Spacing 0.05/0.03mm
• Special process The SAP process flow is adopted.
• Min hole size 0.05mm
• Special technology Laser drilling with a hole diameter of 50um, stacked hole technology, small trace width and trace spacing. The dielectric thickness of the product is 0.05mm.