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High - Layer Multilayer PCB
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10Layer-High Frequency PCB（HDI-1 Level）
Material：
RO4350B+FR-4
Layer：
10
Thickness：
1.6mm
Surface finish：
Immersion gold（ENIG）
Min Track/Spacing：
3.5/4.0mil
Min Hole Size：
CNC 0.15mm/Laser0.10mm
Special technology：
HDI &Rogers 4350B+FR-4
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2Layer PTFE High-frequency PCB
Material：
F4B255
Layer：
2
Thickness：
0.80mm
Surface finish：
Immersion Tin
Min Track/spacing：
6/6mil
Min hole size：
0.3mm
Special technology：
PTFE .contral
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16Layer High-speed material Automotive PCB
Material：
TU-872SLK
Layer：
16
Thickness：
2.0mm
Surface finish：
Immersion gold
Min Track/spacing：
3.5/3.5mil
Min hole size：
0.20mm
Special technology：
High-speed material.Automobile quality standard
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10Layer HDI-4 Level
Material：
S7439---（supplier：SY）
Layer：
10
Thickness：
1.60mm
Surface finish：
Immersion gold
Min Track/spacing：
3.5/3.5mil
Min hole size：
CNC 0.15mm/Laser 0.10mm
Special technology：
HDI 3-Level
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8Layer High-speed Back drill PCB（PanasonicM7）
Material：
MEGTRON7_R-5785(G)---（supplier：Panasonic）
Layer：
8
Thickness：
1.60mm
Surface finish：
Immersion Silver
Min Track/spacing：
4/4mil
Min hole size：
0.20mm
Special technology：
High-speed .Back drill
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8LayerHigh frequency Mixed-stackup CNC blind hole PCB
Material：
RO4003C+FR-4
Layer：
8
Thickness：
1.6mm
Surface finish：
Plating gold 30U
Min Track/spacing：
6/6mil
Min hole size：
CNC0.20mm/blind hole 0.15mm
Special technology：
8 Layer. CNC blind.
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6Layer High-frequency Mixed-stackup PCB（HDI 2-Level）
Material：
RO3003+FR-4
Layer：
6
Thickness：
1.60mm
Surface finish：
Immersion Tin
Min Track/spacing：
4/4mil
Min hole size：
CNC 0.20mm/Laser 0.10mm
Special technology：
HDI 2-Level .High-frequency mixed stackup
技术特点：
Learn More
4Layer High-Speed PCB（HDI 1-Level）
Material：
TU-883
Layer：
4
Thickness：
0.60mm
Surface finish：
Immersion gold(ENIG)+OSP
Min Track/spacing：
4/4mil
Min hole size：
CNC 0.15mm/Laser 0.10mm
Special technology：
Thickened copper 0.5oZ boss process for solder pads.
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4 layer hydrocarbon ceramic PCB
Material：
S7136H--supplier：SY
Layer：
4
Thickness：
1.60mm
Surface finish：
Immersion Tin
Min Track/spacing：
6/6mil
Min hole size：
0.20mm
Special technology：
High frequency-stackup
Learn More
4Layer High-frequency Mixed stackup and Edge Plating
Material：
4Layer High-frequency Mixed stackup and Edge Plating
Layer：
4
Thickness：
1.60mm
Surface finish：
Immersion gold（ENIG）
Min Track/spacing：
3/3mil
Min hole size：
0.20mm
Special technology：
2-kind core mixed stackup.Edge Plating .0.10mm PAD
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4Layer High-frequency Mixed-Stackup PCB
Material：
S7136H+FR-4 Mixed-stackup
Layer：
4
Thickness：
1.6mm
Surface finish：
Immersion gold
Stackup：
2+PP+2
Special technology：
Material mixed stackup.Plating Uniformity
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4Layer High frequency PCB
Material：
S7136H
Layer：
6
Thickness：
1.60mm
Surface finish：
Immersion gold
Min Track/spacing：
4/4mil
Min hole size：
0.20mm
Special technology：
High frequency
Learn More
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