PCB Manufacturing Capabilities
Advanced technology and precision manufacturing for HDI, flexible and rigid-flex PCBs with comprehensive material options.
HDI PCB
High-density interconnect PCBs with advanced layer configurations up to 36 layers and precision laser drilling capabilities.
Flexible PCBs
Flexible and rigid-flex circuits with thin profiles (0.03mm) and excellent durability for dynamic applications.
High-Speed Materials
Extensive material library with various loss characteristics (from standard to extreme low loss) for high-frequency applications.
HDI PCB Technical Capability
| Items | 2024 | 2025 | 2026 | ||||
|---|---|---|---|---|---|---|---|
| Volume | Sample | Volume | Sample | Volume | Sample | ||
| Layer count | ≤24L | ≤36L | ≤24L | ≤36L | ≤24L | ≤36L | |
| Stack-up | 3+N+3 | 4+N+4 | 4+N+4 | Anylayer(10L) | Anylayer(10L) | Anylayer(12L) | |
| Dimension(mm) | MAX | 620*725mm | 620*810mm | 620*725mm | 620*1092mm | 620*725mm | 620*1092mm |
| Board thickness(mm) MAX | 3.2mm | 4.2mm | 3.2mm | 4.2mm | 3.2mm | 4.2mm | |
| Impedance tolerance | Diff>50ohm | ±10% | ±7% | ±10% | ±7% | ±8% | ±7% |
| Single 50ohm | ±10% | ±8% | ±8% | ±6% | ±8% | ±6% | |
High Speed Material Library
| Loss | DF 10GHz | Class | ITEQ | EMC | TUC | Panasonic | Others |
|---|---|---|---|---|---|---|---|
| Std loss | >0.018 | Class 1 | IT-158 IT-180A/L |
EM-825/I EM-827/I |
TU-668 TU-768 |
R-1566W/WN | NY2150/M H150(LF) |
| Mid loss | 0.018-0.012 | Class 2 | IT-170GRA IT-1801 |
EM-370(D) EM-390 |
TU-862 HF TU-747 HF |
/ | H175HF S7045G |
| 0.012-0.009 | Class 3 | IT-170GT IT-150GS |
EM-828G | TU 862(S) | M2 | NY3170M S7040G |
Advanced Manufacturing Processes
Precision Drilling
Laser drilling capabilities down to 0.05mm with high aspect ratio up to 16:1 for reliable interconnects.
Advanced Lamination
Hybrid lamination technology combining different materials for optimal electrical performance.
Fine Line Circuitry
Capability to produce 1.8mil line/space for high-density designs and miniaturized components.
Flexible & Rigid-Flex Capabilities
| Items | 2024 | 2025 | 2026 | ||||
|---|---|---|---|---|---|---|---|
| Material | Flexible substrate | Non-adhesive, adhesive, LCP | Non-adhesive, adhesive, LCP | Non-adhesive, adhesive, LCP | |||
| Stiffener | PI、FR4、steel、Aluminium | PI、FR4、steel、Aluminium | PI、FR4、steel、Aluminium | ||||
| Layers | 4L | 6L | 8L | ||||
| Min finished thickness | 0.03mm | 0.03mm | 0.03mm | ||||
Special Technologies
POFV
Plating over foil via technology for enhanced reliability and design flexibility.
N+N Stack-up
Flexible layer configuration supporting complex high-density interconnect designs.
Hybrid Lamination
Combining different materials to achieve optimal electrical and mechanical properties.
Metallized Half Hole
Specialized edge plating for compact interconnect solutions and board-to-board connections.
