Engineering Characteristics and Technical Implementation of Rigid High-Layer Count PCBs
1. Core Material System and Physical PropertiesRigid high-layer count PCBs (typically ≥16 layers) utilize modified FR4-370HR epoxy substrates with critical parameters:①Dielectric constant (Dk): 4.2±0.05@1GHz (IPC-TM-650 2.5.5.9)②Dissipat...