제품 > IC Substrate 제품 > CSP IC Substrate

CSP IC Substrate

CSP IC Substrate

제품 사양

  • Material BT
  • Layer 2 layer
  • Thickness 0.2mm
  • Surface finish Electroless Nickel - Gold: Nickel thickness 120 - 240U, Gold thickness: 2U
  • Min Track/Spacing 0.08/0.04mm
  • Special process The concentricity requirement for the circuits on both sides of the product is 0.05mm. The Subtractive process is adopted.
  • Min hole size 0.1mm
  • Special technology The tolerance accuracy of the drilling equipment is 0.03MM. Small hole diameter, small trace width and trace spacing.

관련 제품

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