8 Layer HDI Rigid-Flex PCB

제품 사양

• Material S1000-2M+ Polyimide（SY）
• Layer 8L(2R+4F+2R)
• Thickness 1.03mm 土10%
• Min Track/spacing 0.076 / 0.1mm
• Min hole size 0.10mm
• Surface finish Immersion gold(ENIG)
• Special technology 2-Level HDI.Multi - Layered Laser Decapping.HI-POT