6L（2-Level）IC packaging
製品仕様
- Material BT
- Layer 6Layer（2-Level）
- Thickness 0.35mm
- Surface finish Electroless Nickel - Palladium - Gold: Nickel thickness 120 - 240U, Palladium thickness: 2U, Gold thickness: 2U
- Min Track/Spacing 0.05/0.03mm
- Special process The SAP process flow is adopted.
- Min hole size 0.05mm
- Special technology Laser drilling with a hole diameter of 50um, stacked hole technology, small trace width and trace spacing. The dielectric thickness of the product is 0.05mm.
