2-layer IC packaging substrate
製品仕様
- Material BT
- Layer 2-layer
- Thickness 0.3mm
- Surface finish Electroless Nickel - Palladium - Gold: Nickel thickness 120 - 240U, Palladium thickness: 2U, Gold thickness: 2U
- Min Track/Spacing 0.05/0.05mm
- Special process The Subtractive process flow is adopted.
- Min hole size 0.1mm
- Special technology Small hole diameter, small trace width and trace spacing. The concentricity requirement for the circuits on both sides of the product is 0.05mm.
