PCBMASTER PTFE High - Frequency Board Manufacturing Process:

Frequency Board Manufacturing Process:

An important process - Hole treatment: Plasma cleaning machine (Plasma)

Difficulties in Manufacturing High - Frequency Boards:

A. Copper Plating:

It is not easy for copper to deposit on the hole walls.

B. Solder Mask:

Control over the adhesion of the solder mask and the occurrence of blistering in the solder mask.

C. Machining:

Due to the characteristics of the board materials, special cutting tools and specific parameters need to be used.

D. Process:

Strict control should be exerted over each process to prevent defects such as scratches, pits, and dents on the board surface.

About the Author

Carol Luo

PCB Design Engineer

I'm Carol, a PCB Engineer at PCBMASTER with experience in PCB design and manufacturing engineering since 2018. I focus on translating engineering requirements into reliable PCB solutions, with expertise in stack-up design, material selection, and design-for-manufacturing (DFM). I share practical engineering insights from real-world PCB design and production experience.

Visit Carol Luo's Profile