2-layer IC packaging substrate

Spécifications du produit

• Material BT
• Layer 2-layer
• Thickness 0.3mm
• Surface finish Electroless Nickel - Palladium - Gold: Nickel thickness 120 - 240U, Palladium thickness: 2U, Gold thickness: 2U
• Min Track/Spacing 0.05/0.05mm
• Special process The Subtractive process flow is adopted.
• Min hole size 0.1mm
• Special technology Small hole diameter, small trace width and trace spacing. The concentricity requirement for the circuits on both sides of the product is 0.05mm.