Metal Core PCBs
Engineered for Heat.
Built for Power.
Aluminum, Copper & Iron Core PCB Customization. Stable Heat Dissipation for High-Power Electronics.
Choose Your Metal Core
Custom aluminum, copper & iron-core MCPCBs. Prototyping & mass production. Versatile material solutions for LED, power, industrial control, new energy & automotive electronics.
The Workhorse of Gestion thermique
Aluminum PCBs power over 70% of all metal-core applications worldwide. Our aluminum substrate delivers reliable thermal management at a price point that makes economic sense from prototype to mass production. With 1–10 layer capability and four structural configurations, we cover everything from simple LED boards to complex power modules.
Stack-Up & Process Under One Roof
We offer diverse MCPCB stack-up configurations backed by full fabrication processes. Structures including metal sandwich, Cu-Al hybrid and thermal-electric separation satisfy varied thermal & mechanical requirements.
Stack-Up Configurations
4 structural architectures for every thermal scenarioMetal Sandwich
Symmetrical Thermal Design
Double-sided circuits on both sides of metal core. Symmetrical heat dissipation, max rigidity.
Single-Side Multi-Layer
HD Single/Double-Sided Stack-Up
Multi-layer circuit pressed onto one side of metal core. Up to 10 layers on Al or Cu substrates.
Cu-Al Hybrid
Cost-Performance Balanced
Copper thermal layer bonded to aluminum base. Near-copper performance at a fraction of the cost.
Thermal-Electric Separation
Ultimate Thermal Performance
Components directly on copper core — zero dielectric barrier. Unlocks full 385 W/mK.
Core Processes
4 precision manufacturing techniquesPTH vias connect circuits on both sides of metal core. Higher density, dual-side placement.
FR4 layers pressed above metal core. Up to 10 layers for complex routing with thermal grounding.
FR4 and metal substrate co-laminated on one panel. Zoned thermal for cost optimization.
0.5-4 oz copper traces for high-current power. Extreme thermal + electrical load for EV/IGBT.
Not sure which configuration fits your design? Let our engineers analyze your thermal requirements.
Why Engineers Choose PCBMASTER
Team with 20 years industry experience. 12,000+ projects. Zero shortcuts on quality.
24H Prototyping
Gerber to prototype in one business day across all three substrates. Expedited same-day available for aluminum.
99.5% Yield
AOI + flying probe on every board. Cross-section analysis on first articles. Zero-defect shipments.
Factory-Direct
Own SMT + CNC. No middlemen. Save 20-40% vs. trading companies. Full production visibility.
Revue gratuite de DFM
Expert design review on every order — catch trace width, clearance, and thermal issues before production.
Material & Process Capacités
One complete reference — compare all three substrates side-by-side, then review our fabrication precision and quality assurance standards.
Side-by-Side Material Comparison
| Paramètre | Aluminum (Al) | Copper (Cu) | Iron (Fe) |
|---|---|---|---|
| Conductivité thermique | 1–10 W/mK | 2–385 W/mK | 1–2 W/mK |
| Compte de couche | 1–10 Layers | 1–10 Layers | 1–2 Layers |
| Épaisseur de conseil | 0.6–4.0 mm | 0.6–4.0 mm | 0.6–4.0 mm |
| Épaisseur de cuivre | 0.5–4 oz | 0.5–4 oz | 0.5–4 oz |
| Min. Trace/Space | 3/3 mil | 3/3 mil | 3/3 mil |
| Finition de surface | ENIG · HASL OSP · IAg | ENIG · HASL OSP · IAg | ENIG · HASL OSP · IAg |
| Dielectric Strength | > 3.0 kV | > 4.0 kV | > 2.5 kV |
| CTE (ppm/°C) | 23–25 | 17–18 | 11–13 |
| Glass Transition (Tg) | 130°C | 170°C | 140°C |
| Magnetic Permeability | Aucun | Aucun | μ > 200 |
| Cost Level | $ Economy | $$$ Premium | $$ Specialty |
| Best Applications | LED, Consumer, Power Supply | Automotive, IGBT, EV, Solar | Motor Control, Magnetic, EMI |
Quality & Testing
Advanced Thermal Specs
Premium Base Materials
Sourcing from world-class dielectric and metal-core suppliers
Not sure which substrate fits your design? Let our engineers recommend the right solution.
Register for a Free ConsultationTrusted by Industry Leaders
Proven thermal solutions across LED, automotive, and telecom.
Street Lighting
500W COB modules had 30%+ failure rate from thermal fatigue on standard FR4.
On-Board Charger
6.6kW OBC in sealed enclosure needed 40A continuous current handling with zero airflow.
AAU Power Amp
64T64R AAU with 800W GaN PAs needed thermal + RF signal integrity on one board.
Trusted by Industry Leaders
"We source aluminum PCBs for our LED driver lineup. MetalCorePCB consistently hits 2.5W/mK with zero delamination. They caught 2 design issues in DFM that saved us a costly respin. Now our sole MCPCB supplier."
"Our EV inverter needed 6W/mK copper core. MetalCorePCB delivered 3-day prototypes that passed thermal cycling first try. Their understanding of high-power thermal management is best-in-class. Production volumes have been flawless."
"Iron-based PCBs for our motor controllers were impossible to source reliably — until MetalCorePCB. Their specialty substrate program is unmatched. Magnetic performance exceeded our spec by 15%. This partnership is strategic for us."
Ready to Start Your MCPCB Project?
Free DFM review • Priority 24H prototyping • New users get $600 coupon
Sign Up to Claim Your $600 CouponFrequently Asked Questions
It depends on your thermal budget, application environment, and cost targets.
- En aluminium (1-10 W/mK, 1-10 layers) handles 80% of applications — LED, consumer, power supplies — at the best price.
- Cuivre (2-385 W/mK, 1-10 layers) is for extreme heat: automotive, IGBT, EV charging.
- Iron (1-2 W/mK, 1-2 layers, μ>200) is for specialty magnetic/EMI applications.
Not sure? Register for a free consultation — our engineers will spec the optimal substrate for your design.
We manufacture four structures:
- Metal Sandwich — circuits on both sides, ideal for double-sided assemblies.
- Single-Side Multi-Layer — up to 10 layers on one side, for complex routing.
- Cu-Al Hybrid — copper thermal layer on aluminum base, best cost-performance ratio.
- Thermal-Electric Separation — direct metal contact without dielectric, unlocks full 385 W/mK for maximum heat dissipation.
Our engineers will recommend the right configuration based on your thermal simulation and budget.
We support four core process technologies:
- Double face — circuits on both sides with PTH vias.
- Multi-Layer Sandwich — FR4 layers pressed above metal core, up to 10 layers.
- Stratification hybride — FR4 and metal substrate co-laminated on the same board for zoned thermal management.
- Heavy Copper — up to 4 oz for high-current power delivery.
All processes are done in-house — no outsourcing.
Prototyping starts at just 5 pieces per design across all three substrates.
Production runs typically begin at 100 pieces, but we also accommodate low-volume production for specialized projects.
No minimums for registered customers on their first order.
- ENIG (gold) — best for fine-pitch and long shelf life.
- HASL-LF (lead-free) — cost-effective for through-hole.
- OSP — budget option for quick-turn.
- Immersion Silver — excellent for high-frequency.
We recommend ENIG for most metal core applications.
Prototyping: 24-48 hours for all three substrates.
Production: 5-7 business days.
Shipping via DHL/FedEx: 3-5 days to North America/Europe, 2-3 days within Asia.
Same-day expedited available for aluminum prototypes.
