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Produkte. > Metal Base-PCB Produkte. > Thermoelectrically Separated Copper-based PCB

Thermoelectrically Separated Copper-based PCB

Thermoelectrically Separated Copper-based PCB

Produktspezifikationen

  • Material copper base material
  • Layer 1
  • Thickness 2.0mm
  • Thermal conductivity 3W/mK
  • Dielectric thickness 5mil
  • Special technology Thermoelectric Separation
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