CSP IC Substrate

Produktspezifikationen

• Material BT
• Layer 2 layer
• Thickness 0.2mm
• Surface finish Electroless Nickel - Gold: Nickel thickness 120 - 240U, Gold thickness: 2U
• Min Track/Spacing 0.08/0.04mm
• Special process The concentricity requirement for the circuits on both sides of the product is 0.05mm. The Subtractive process is adopted.
• Min hole size 0.1mm
• Special technology The tolerance accuracy of the drilling equipment is 0.03MM. Small hole diameter, small trace width and trace spacing.