Fillers - Another Component of FR - 4 Material

The role of fillers is to meet higher requirements for electrical or mechanical properties.

For example:

• Nelco's N4000 - 7 uses fillers to increase the glass transition temperature (Tg) and reduce the coefficient of thermal expansion (CTE).
• Hitachi's MCF - 6000E adds fillers to enhance the filling performance.
• Rogers' RO4350B incorporates ceramic particles as fillers to control the dielectric constant.

In addition, by adding other fillers as flame retardants to replace halogen flame retardants, the requirement for being halogen - free can be achieved.

Alright, the above are the basic components of our PCB copper - clad laminates. Now, let's take a look at the production process of copper - clad laminates:

About the Author

David Lee

PCB Technical Director

I'm David Lee, PCB Technical Director at PCBMASTER with 17+ years of experience in PCB engineering. I specialize in high-speed/RF design, DFM optimization, SI/PI validation, and mass-production engineering, leading cross-functional teams to solve complex design-to-manufacturing challenges. I focus on delivering high-performance PCB solutions that balance electrical performance and manufacturability.

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