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제품 > HF&HS PCB 제품 > 6Layer High-frequency Mixed-stackup PCB（HDI 2-Level）

6Layer High-frequency Mixed-stackup PCB（HDI 2-Level）

6Layer High-frequency Mixed-stackup PCB（HDI 2-Level）

제품 사양

  • Material RO3003+FR-4
  • Layer 6
  • Thickness 1.60mm
  • Surface finish Immersion Tin
  • Min Track/spacing 4/4mil
  • Min hole size CNC 0.20mm/Laser 0.10mm
  • Special technology HDI 2-Level .High-frequency mixed stackup
  • 技术特点
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