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제품 > Special - type PCB 제품 > 8 Layer-BGA Substrate PCB

8 Layer-BGA Substrate PCB

8 Layer-BGA Substrate PCB

제품 사양

  • Material SH260 TG250
  • Layer 8
  • Thickness 2.0mm
  • Surface finish Nickel-Palladium-Gold
  • Min Track/Spacing 2.5/2.5mil
  • Min Hole size 0.15
  • Special technology Via filled with resin+plating filling .Little line spacing.
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