8 Layer-BGA Substrate PCB
製品仕様
- Material SH260 TG250
- Layer 8
- Thickness 2.0mm
- Surface finish Nickel-Palladium-Gold
- Min Track/Spacing 2.5/2.5mil
- Min Hole size 0.15
- Special technology Via filled with resin+plating filling .Little line spacing.
