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Produkte. > Metal Base-PCB Produkte. > Thermoelectric Separation Copper and aluminum mixed base PCB

Thermoelectric Separation Copper and aluminum mixed base PCB

Thermoelectric Separation Copper and aluminum mixed base PCB

Produktspezifikationen

  • Material Copper and aluminum mixed
  • Layer 1
  • Thickness 2.0mm
  • Thermal conductivity 2W/mK
  • Dielectric thickness 4mil
  • Special technology copper and aluminum mixed.Thermoelectric Separation
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