Author: Jack WangFlexible Printed Circuit Boards (FPCs) are emerging as crucial components in consumer electronics, medical devices, and automotive electronics. Multilayer FPCs, leveraging their high - density interconnection and 3D wiring ...
Author: Jack WangI. PCB: The "Lifeline" of Modern Electronic Devices From smartphones to space satellites, Printed Circuit Boards (PCBs) serve as the core framework of all electronic devices. Statistics show that the global PCB market reach...
Author: Jack WangI. Why Does a PCB Board "Deform" When Heated? Inspiration from a Beer Bottle CapWhen you open an iced beer, have you ever noticed the property of the metal bottle cap shrinking when it gets cold? The materials in a PCB boar...
Author: Jack WangIn the global electronics manufacturing industry, the reliability of PCBs (Printed Circuit Boards) and PCBA (Printed Circuit Board Assembly) directly affects the lifespan and performance of end - products. However, industry...
Author: Jack WangFull-Process Optimization Solution1. The Microscopic Battle of Solder Paste Printing ① Stencil Opening Strategy:→ For 0.3mm pitch BGA, use trapezoidal openings (upper width 0.28mm / lower width 0.32mm), which can increase...
Author: Jack WangIn 5G communication and millimeter - wave radar applications, out - of - control signal integrity (SI) of high - frequency PCBs can directly lead to system failures. Engineers often face three major challenges: signal refle...
Author: Jack WangFailure analysis of an IGBT module used in a new energy vehicle shows that 80% of the failures are caused by solder joint fatigue due to thermal cycling. When the local temperature rise of the PCB exceeds 85°C, the device l...
Author: Jack WangIndustry Demand Case Study:Implantable devices like pacemakers require PCBs to withstand >500,000 bends over 10 years with a thickness ≤0.4mm. Traditional designs showed a 23% failure rate, making rigid-flex PCBs the break...
Author: Jack Wang1. The Golden Rules of Stack - Up Design① Material SelectionWhen the signal rate is ≥10Gbps, ultra - low - loss materials (such as Megtron6 with Df = 0.002) should be preferred. In a certain optical module case, after rep...
Author: Jack WangⅠ.Core Mechanism of Lamination Time Impact on High-Difficulty PCB Quality1. Resin Flow and Impregnation Control①Short Lamination Time (<15% of standard duration):Insufficient resin flow results in inner copper foil surfac...