Author: Jack WangIn today’s electronics industry pursuing extreme thinness and high-density integration, HDI FPC (High-Density Interconnect Flexible Printed Circuit) has become the core enabler for premium electronic devices. This article ...
Author: Jack WangIn the field of Flexible Printed Circuits (FPCs), long-length FPCs typically refer to highly challenging products exceeding 1 meter, even reaching several meters in length. Demand for such devices is surging in applications...
Author: Jack WangI. Core Challenges and Technological Breakthroughs in Multilayer FPC1.Multilayer FPC (4+ layers) achieves 10× higher wiring density than single-sided boards but faces three critical challenges:2.Layer Misalignment: ±25μm re...
Author: Jack WangIn Flexible Printed Circuit (FPC) technology, single-sided FPC is widely used in consumer electronics, medical devices, and automotive sensors due to its simple structure and cost-effectiveness. This article explores critic...
Author: Jack WangⅠ. Alumina Ceramic PCB vs. Aluminum Nitride Ceramic PCB: Type and Performance Comparison1. Alumina Ceramic PCB (Al₂O₃) ① Single-Layer Alumina Ceramic Substrate: Suitable for simple circuit designs, with a thermal conduc...
Author:Jack WangIn the wave of the green transformation in the electronics manufacturing industry, the halogen-free printed circuit board (Halogen-Free Printed Circuit Board) has become a core component in 5G communication, new energy vehic...
Author: Jack WangAs global environmental regulations tighten and consumer electronics demand evolves, Halogen-Free PCBs (Halogen-Free Printed Circuit Boards) are becoming a critical technology in electronics manufacturing. According to the ...
Author:Jack WangAs global carbon neutrality goals advance and demand for high-frequency electronics surges, Halogen-Free PCBs (Halogen-Free Printed Circuit Boards) are transitioning from an "eco-friendly option" to a "performance necessity....
Author: Jack WangAs electronic devices become increasingly compact and intelligent, a substrate the size of a fingernail holds the most intricate secrets of semiconductor manufacturing—the IC substrate (IC Substrate). Serving as the critic...
Author: Jack WangEvery leap in semiconductor technology redefines the performance limits of electronic devices. From 5nm chips to Chiplet heterogeneous integration, rising chip complexity demands more advanced packaging solutions. At the he...