Author: Jack WangDriven by 5G communications, millimeter-wave radar, and high-speed data transmission, high-frequency FPC (Flexible Printed Circuit) has become an indispensable neural pathway for cutting-edge electronic equipment. Unlike tr...
Author: Jack WangWith the growing adoption of wearable medical devices and new energy vehicle BMS systems, demand for ultra-long FPCs (exceeding 1.2 meters in length) has surged. This article provides an in-depth analysis of the critical pe...
Author: Jack WangI. Core Technical Characteristics of PolyimideAs the core substrate material for flexible printed circuits (FPCs), polyimide (PI) films hold over 80% of the market share (per Prismark 2023 data). Their unique properties ori...
Author: Jack Wang1. Definition Standards and Technical Controversies of Halogen-Free Materials1.1 Precise Definition of Halogen-Free MaterialsAccording to the IPC-4101E standard, true halogen-free materials must meet:①Chlorine (Cl) content...
Author: Jack Wang Ⅰ.Technology Evolution Map: From "Lab Formula" to "Mass Production Code" 1. Molecular Design Iteration HistoryFirst Generation (1985–2000): Mitsubishi Gas Chemical’s original formula (BMI/CE=6:4), Tg 180°C, Dk 4.5, limi...
Author: Jack WangⅠ.BT Resin Substrate Diversified Applications: Decoding the Material Powering the High-Frequency EraSince its development in the 1980s, BT resin (Bismaleimide Triazine Resin) has achieved an optimal balance among thermal r...
Author: Jack WangⅠ. Definition and Chemical Basis of BT Resin Substrates BT resin (Bismaleimide Triazine Resin), developed by Mitsubishi Gas Chemical Company in the 1980s, is a thermosetting polymer synthesized through copolymerization of ...
In 2019, a leading smartphone manufacturer faced a major setback with its 5G millimeter-wave antenna module—signal loss at the 28 GHz band was 30% higher than expected. After three months of troubleshooting, engineers traced the root cause...