Author: Jack WangAt the core layer of flexible printed circuit boards (FPCs), selecting copper foil is akin to encoding the genetic blueprint of the circuit. As the neural pathways for electronic signals, rolled annealed copper (RA) and ele...
Author：Jack Wang Flexible Printed circuit stiffeners offering mechanical support to the flexible part of the circuit. This is essential for meeting requirements related to mounting, interfacing (e.g., connectors, gold fingers), soldering (...
Author: Jack WangDriven by 5G communications, millimeter-wave radar, and high-speed data transmission, high-frequency FPC (Flexible Printed Circuit) has become an indispensable neural pathway for cutting-edge electronic equipment. Unlike tr...
Author: Jack WangWith the growing adoption of wearable medical devices and new energy vehicle BMS systems, demand for ultra-long FPCs (exceeding 1.2 meters in length) has surged. This article provides an in-depth analysis of the critical pe...
Author: Jack WangI. Core Technical Characteristics of PolyimideAs the core substrate material for flexible printed circuits (FPCs), polyimide (PI) films hold over 80% of the market share (per Prismark 2023 data). Their unique properties ori...
Author: Jack Wang1. Definition Standards and Technical Controversies of Halogen-Free Materials1.1 Precise Definition of Halogen-Free MaterialsAccording to the IPC-4101E standard, true halogen-free materials must meet:①Chlorine (Cl) content...
Author: Jack Wang Ⅰ.Technology Evolution Map: From "Lab Formula" to "Mass Production Code" 1. Molecular Design Iteration HistoryFirst Generation (1985–2000): Mitsubishi Gas Chemical’s original formula (BMI/CE=6:4), Tg 180°C, Dk 4.5, limi...
Author: Jack WangⅠ.BT Resin Substrate Diversified Applications: Decoding the Material Powering the High-Frequency EraSince its development in the 1980s, BT resin (Bismaleimide Triazine Resin) has achieved an optimal balance among thermal r...