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Must-Read for Electronics Engineers Characteristics and Selection Guide for 7 Types of PCB Substrate Materials


Author:Jack Wang


At the failure analysis site of a 5G base station power module, we once encountered a case where an entire batch of products failed thermally due to incorrect substrate selection. This article deciphers the "genetic code" of mainstream PCB substrates based on IPC-4101 standards and tested data.

 

 

1. FR-4:The Reinforced Concrete of the Electronics Industry  FR-4--HDI PCB   /  FR-4--High - Layer Multilayer PCB 


Composition Profile
Fiberglass cloth (60%) + Epoxy resin (35%) + Flame retardant (5%), compliant with UL94 V-0 fire rating.


Performance Parameters

Dielectric Constant (Dk): 4.2–4.8 @1MHz

Dissipation Factor (Df): 0.018–0.025

Glass Transition Temperature (Tg): 130–180°C

Thermal Conductivity: 0.3 W/m·K

 

 

 

Design Considerations
Use high-Tg variants (e.g., S1000-2) for multilayer boards.
Loss increases sharply above 1 GHz.


Typical Application: Smart appliance control boards (Haier’s latest air conditioner mainboard tested at 1.6mm thickness).

 

 

2. Metal-Core PCBs: Thermal Management Experts  Metal Base-PCB


Structural Anatomy
1mm aluminum layer (6061-T6) + 75μm insulation layer (epoxy resin + ceramic filler) + 35μm copper foil.


Key Metrics

Thermal Resistance: 0.5–3.0°C·in²/W

Breakdown Voltage: ≥3 kV

Peel Strength: ≥1.5 kgf/cm

 




Selection Tips
Use models with thermal conductivity >2.0 W/m·K for LED automotive lighting.
EV charging piles require 3,000 thermal shock cycles.


Case Study: Tesla Model Y taillight module (operating range: -40°C to 125°C).

 

 

3. Ceramic Substrates: Survivors in Extreme Environments  Alumina & AlN Ceramic-PCB

 

 


Material Comparison

Type

Alumina (Al₂O₃)

Aluminum Nitride (AlN)

Silicon Nitride (Si₃N₄)

Thermal Cond.

24 W/m·K

180 W/m·K

90 W/m·K

Flex Strength

400 MPa

320 MPa

800 MPa

Cost Index

1x

5x

8x

 

Applications
High-speed rail IGBT modules (tested at 15kV on Beijing-Shanghai line).
Lunar spacecraft power systems (Chang'e-5 operated under 300°C temperature swings).

 

 

4. PTFE High-Frequency Boards: Runways for the Millimeter-Wave Era   High- Frequency PCB

 

 


Formula Evolution
First-gen pure PTFE (Dk=2.1) → Ceramic-filled (RO3003, Dk=3.0±0.04) → LCP composite (Dk=2.9@40GHz).

 

Tested Data

Loss <0.0015 @10 GHz

Z-axis CTE: 25 ppm/°C


Fabrication Challenge: Requires plasma treatment for reliable hole metallization.

 

Design Case: Huawei 5G AAU antenna board (64TRx channels, 3.5GHz band).

 

 

5. High-Speed Materials: Guardians of Signal Integrity   High- Speed PCB

 


 

Three Technical Routes

1.Modified epoxy (e.g., MEGTRON6, Df=0.002)

2.Hydrocarbon-based (Tachyon-100G, Dk=3.2)

3.Liquid Crystal Polymer (LCP, Df=0.0025@110GHz)

 

Golden Rule: For signal rates >56 Gbps, prioritize glass fabric with low dispersion (e.g., NE-glass 1037).

 

 

6. BT Resin Substrates: Invisible Wings for Chip Packaging  Special - type PCB

 

 


Microstructure
Bismaleimide Triazine resin + spherical silica (0.5μm particle size).


Advanced Packaging Uses

FCBGA substrates (20/20μm line/space).
2.5D silicon interposers (10μm TSV diameter).


Test Result: Warpage <0.1% after 300°C reflow.

 

 

7. Halogen-Free Materials: Mandatory Course in Green Manufacturing  Special - type PCB


Eco-Performance Comparison



Comparison of environmental indicators

Parameter

Traditional

Halogen-Free

Bromine Content

>15%

<900 ppm

Combustion Toxins

Dioxins emitted

Only CO₂/H₂O

Decomposition

100 years

30 years

 

Medical Application: Medtronic pacemaker PCB compliant with ISO10993 biocompatibility.

 

 

2024 Selection Decision Tree


1.Frequency >10 GHz → PTFE/High-Speed Materials

2.Power Density >50 W/cm² → Ceramic Substrates

3.Eco-Mandates → Halogen-Free

4.Cost-Sensitive → FR-4


(Data sourced from IPC standards and 2024 third-party lab reports. Cite test conditions when repurposing.)


FR-4 Laminate: Definition, Core Properties, and Engineering Application Guide

Full analysis of metal core PCB technology From material properties to engineering practice guidelines

Technical Analysis of Ceramic Substrates Definition, Properties, and Engineering Applications

Technical Analysis of PCB High-Frequency Boards A Comprehensive Guide to Definition, Core Characteristics, and Engineering Applications

PCB High-Speed Material Technology Guide Key Selection Criteria and Practical Applications

BT Resin Substrate Technology Analysis Definition, Characteristics, and Engineering Applications Guide

Comprehensive Analysis of Halogen-Free PCB Materials A Technical Guide from Definition to Engineering Implementation


Author:Jack Wang

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