What Are Metal Substrates & High - Conductivity Copper Substrates? How Much Do You Know? Ask PCB MASTER COMPANY for an Explanation

I. Material Overview

The high - conductivity copper substrate is a kind of metal substrate material laminated by high - performance copper foil and an insulating dielectric layer.  It has excellent thermal conductivity, electrical performance and good processing performance, and is an important part of the heat dissipation solutions for electronic components.  The high - conductivity copper substrate is widely used in the thermal management systems of high - frequency and high - power electronic equipment, and can effectively improve the stability and reliability of the equipment.

II. Type Classification

The high - conductivity copper substrate can be divided into multiple types according to its structure, performance and application fields. Common classification methods include:

Classification by structure: single - layer high - conductivity copper substrate, double - layer high - conductivity copper substrate, multi - layer high - conductivity copper substrate.

Classification by copper foil thickness: thin - type high - conductivity copper substrate (such as 35μm copper foil), standard - type high - conductivity copper substrate (such as 70μm - 140μm copper foil), thick - type high - conductivity copper substrate (such as 280μm copper foil).

Classification by thermal conductivity: ordinary - thermal - conductivity high - conductivity copper substrate, high - thermal - conductivity high - conductivity copper substrate.

I. Core Technologies

The core technologies of high - conductivity copper substrates mainly include:

Copper Foil Preparation Technology: As the main heat - conducting material of high - conductivity copper substrates, the preparation technology of copper foil directly affects the thermal conductivity of the substrates. Common copper foil preparation technologies include electroplating and chemical vapor deposition.

Dielectric Layer Preparation Technology: The dielectric layer is an important part of high - conductivity copper substrates, and its preparation technology is related to the electrical performance and thermal stability of the substrates. Common dielectric layer preparation technologies include resin coating and hot - pressing.

Lamination Technology: Lamination technology is a crucial step in the production of high - conductivity copper substrates and directly affects the overall performance of the substrates. High - quality lamination technology can ensure a close bond between the copper foil and the dielectric layer and improve the thermal and electrical performance of the substrates.

II. Thermal Conductivity

High - conductivity copper - substrate circuit boards have excellent thermal conductivity, and their thermal conductivity coefficients are much higher than those of traditional metal and plastic materials.  Depending on the thickness of the copper foil and the material of the dielectric layer, the thermal conductivity of high - conductivity copper substrates may also vary. In actual applications, an appropriate high - conductivity copper substrate can be selected according to specific requirements to meet the equipment's heat - dissipation performance requirements.

III. Copper Foil Requirements

As the main heat - conducting material of high - conductivity copper substrates, the performance of copper foil directly affects the thermal conductivity of the substrates. The main requirements for copper foil used in high - conductivity copper substrates are as follows:

Thickness Requirement: The thickness of the copper foil can be selected according to actual needs. Common copper foil thicknesses include 35μm, 70μm, 105μm, 140μm, and 280μm.

Conductivity: The copper foil should have good conductivity to ensure the stable operation of high - conductivity copper substrates in high - frequency and high - power equipment.

Surface Quality: The copper foil surface should be flat, without scratches, oxidation, and other defects to improve the bonding strength between the copper foil and the dielectric layer.

IV. Application Areas

High - conductivity copper substrates are widely used in the following areas:

Communication Field: Such as the heat - dissipation systems of base stations, switches, and routers.

Power Supply Field: Such as the heat - dissipation systems of UPS power supplies and electric vehicle charging piles.

Industrial Control Field: Such as the heat - dissipation systems of PLC controllers and inverters.

Military Field: Such as the heat - dissipation systems of radars and missiles.

V. Mechanical Properties

High - conductivity copper substrates have good mechanical properties, including bending strength, tensile strength, hardness, and other indicators. These mechanical properties ensure that high - conductivity copper substrates are not easily deformed, cracked, or damaged during processing and use, improving the reliability and durability of the substrates.  At the same time, good mechanical properties also facilitate secondary processing operations such as cutting and drilling of high - conductivity copper substrates to meet different application requirements.

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