Types of Alumina/Aluminum Nitride Ceramic Substrate Materials, PCB Preparation Processes and Their Applications
PCB MASTER has rich experience and advanced technological capabilities in the production and application of alumina (Al₂O₃) and aluminum nitride (AlN) ceramic-based PCB substrate materials. The following is a detailed introduction to the types, preparation processes and applications of these two ceramic-based PCB substrate materials:
Types of copper-clad ceramic substrates:
DPC (Direct Plated Copper) 0.5 - 10 ounces.
LTCC (Low Temperature Co-fired Ceramic) (Silver Paste Circuit)
DBC (Direct Bonding Copper) (High-temperature Bonding of Ceramic and Copper Foil)
Performance of ceramic substrates:
Copper bonding force (N/cm²): ≥ 10
Thermal conductivity (W/m·K): For 96% alumina ceramic, it is 20 - 27 W/m·K;
for aluminum nitride ceramic, it is 180 - 220 W/m·K.
Warpage (mm): 3‰ (0.3 mm per 100 mm).
Specifications of Ceramic Substrate Materials:
Common large - sized material dimensions in mm:
114 * 114, 120 * 120, 140 * 130, 190 * 140
Common large - sized material thicknesses in mm:
0.2, 0.25, 0.3, 0.38, 0.5, 0.635, 0.8, 1.0, 1.2, 1.5, 2.0
Types of Alumina Ceramic - based PCBs
1. Single-layer alumina ceramic substrates: They are suitable for simple circuit designs and possess good thermal conductivity and electrical insulation properties.
2. Multilayer alumina ceramic substrates: Through lamination and drilling techniques, complex circuit designs can be achieved, and they are applicable to application scenarios requiring high-density integration.
3. Metallized alumina ceramic substrates: Metallization treatment is carried out on alumina ceramic substrate circuit boards to form conductive layers, which are suitable for the packaging of electronic components that require high thermal conductivity.
Types of Aluminum Nitride Ceramic-based PCBs
1. Single-layer aluminum nitride ceramic substrates: They are suitable for simple circuit designs and have higher thermal conductivity and lower dielectric constant.
2. Multilayer aluminum nitride ceramic substrates: Through lamination and drilling techniques, complex circuit designs can be achieved, and they are applicable to application scenarios requiring high-density integration and high-frequency communication.
3. Metallized aluminum nitride ceramic substrates: Metallization treatment is carried out on aluminum nitride ceramic substrates to form conductive layers, which are suitable for the packaging of electronic components that require ultra-high thermal conductivity.
Preparation Processes of Alumina/Aluminum Nitride Ceramic-based PCB Boards
1. Substrate Preparation: High-purity alumina or aluminum nitride ceramic substrates are used. Through precision machining technologies, the dimensional accuracy and flatness of the substrates are ensured.
2. Metallization Treatment: Metallization treatment is carried out on the ceramic substrates. Usually, through electroless plating or vacuum coating technologies, a conductive metal layer, such as copper or silver, is formed on the surface of the ceramic substrates.
3. Pattern Transfer: Through lithography technology, the designed circuit board patterns are transferred onto the metallized layer to form circuit patterns.
4. Etching and Cleaning: Using etching technology, the metal layers in the non-circuit areas are removed to form clear circuit patterns. Then cleaning is performed to ensure that the surface is clean.
5. Drilling and Hole Plating: According to the requirements of circuit design, necessary holes are drilled in the substrates and then hole plating is carried out to achieve the connection between multilayer circuits.
6. Surface Treatment: Surface treatments, such as anti-oxidation treatment and immersion gold treatment, are carried out to improve the stability and reliability of the circuits.
7. Assembly and Testing: Electronic components are soldered onto the ceramic-based PCB boards for assembly and testing to ensure the functions and performance of the circuits.
Application Areas
1. Electronic Packaging: Used as packaging substrates for integrated circuits, microwave devices, and power electronic devices.
2. LED Packaging: Especially in high - brightness LEDs and laser diodes, it is used as a heat - dissipation substrate.
3. Sensors: Ceramic - based PCB boards can be used to manufacture various sensors, such as temperature sensors and pressure sensors.
4. High - Temperature Structural Materials: In the metallurgical and chemical industries, it is used to manufacture high - temperature furnace tubes, crucibles, etc.
5. Microwave and Radio - Frequency Devices: Due to its low dielectric constant and high thermal conductivity, it is suitable for high - frequency communication equipment.
6. Semiconductor Packaging: Used for the packaging of high - end integrated circuits, providing good thermal management and electrical insulation properties.
7. IGBTs have a high output power and generate a large amount of heat. Poor heat dissipation will damage the IGBT chips.
PCB MASTER Company manufactures high-quality alumina and aluminum nitride ceramic-based PCB substrate materials through advanced preparation processes and technologies, which are widely used in multiple fields such as electronics, optoelectronics, and sensors. The company will continue to be committed to technological innovation and process improvement to provide customers with higher-quality products and services.