PCBMASTER Takes You to Predict the Growth Trends of Sub - categories such as High - Frequency Boards, HDI Boards, and Flexible Boards

Author: Jack Wang

Forecast of Growth Trends of High - Frequency Boards, HDI Boards, and Flexible Boards (2024 - 2030)

With the rapid development of 5G communication, AI computing power, miniaturization of consumer electronics, and new energy vehicles, the three sub - categories of high - frequency boards, HDI boards, and flexible boards are becoming the core engines driving the growth of the PCB industry. This article predicts their future growth trends based on technological evolution, market demand, and industrial chain dynamics.

I. High - Frequency Boards: Propelled by 5G and Satellite Communication

1. Market Status Quo

Market Size in 2023: Approximately $4.5 billion (accounting for 7% of the total PCB market).

Main Applications: 5G base stations (AAU/RRU), millimeter - wave devices, satellite communication terminals, automotive radars (77GHz).

Technical Thresholds: Dependent on high - frequency materials (such as Rogers, Teflon), and precise impedance control (±5%).

2. Growth Drivers

Global Deployment of 5G Base Stations: China aims to build 5 million base stations by 2025, and demand from emerging overseas markets (such as India and Southeast Asia) is following suit.

Commercialization of Millimeter - Waves: Verizon in the United States and NTT in Japan are accelerating the construction of millimeter - wave base stations, and the requirement for the loss of high - frequency laminates has been increased to Df ≤ 0.0015.

Boom of Low - Earth - Orbit Satellites: Companies like Starlink and OneWeb are driving the demand for PCBs in satellite communication. The market size is expected to exceed $800 million by 2025.

3. Growth Forecast

Compound Annual Growth Rate (CAGR): 14.2% from 2024 - 2030 (data from Prismark).

Market Size in 2030: To exceed $12 billion.

Regional Share: China (45%), North America (30%), Europe (15%).

4. Technological Trends

Material Substitution: Low - cost hydrocarbon materials (such as Panasonic MEGTRON 6) gradually replace Rogers.

Integrated Design: High - frequency boards are integrated with heat - dissipating substrates (aluminum - based/copper - based) for packaging.

II. HDI Boards: AI and Consumer Electronics Driving the High - Density Revolution

1. Market Status Quo

Market Size in 2023: Approximately $12 billion (accounting for 18% of the total PCB market).

Main Applications: Smartphones (70%), servers/switches (15%), automotive electronics (10%).

Technical Classification: First - order HDI (for mobile phone motherboards), HDI above the second - order (for high - end mobile phones/servers), any - layer HDI (ELIC).

2. Growth Drivers

Demand for AI Servers: The usage of HDI boards in a single AI server is 3 - 5 times that of a traditional server (for example, the NVIDIA DGX H100 requires 8 HDI substrates).

Upgrades of Smartphones: Foldable smartphones drive the demand for Any - layer HDI with more than 20 layers (such as the Samsung Galaxy Z Fold5).

Automotive Intelligence: Autonomous driving domain controllers (DCU) use 6 - 8 - layer HDI boards with a line width/line spacing ≤ 75/75μm.

3. Growth Forecast

Compound Annual Growth Rate (CAGR): 11.8% from 2024 - 2030.

Market Size in 2030: To exceed $25 billion.

Change in Application Proportion: The share of consumer electronics will drop to 50%, while the share of AI/automotive will increase to 40%.

4. Technological Trends

Popularization of the mSAP Process: The line width/line spacing is moving towards 30/30μm, replacing the traditional subtractive method.

Substrate - like Packaging: The integration of HDI and IC substrate technologies (such as Intel EMIB).

III. Flexible Boards (FPC): A Blue Ocean Market for Wearable and Automotive Electronics

1. Market Status Quo

Market Size in 2023: Approximately $16 billion (accounting for 24% of the total PCB market).

Main Applications: Smartphones (50%), wearable devices (20%), automotive electronics (15%).

Technical Pain Points: Bending life (>100,000 times), high - temperature resistance (automotive applications require resistance to 125°C).

2. Growth Drivers

Boom of Wearable Devices: Products like the Apple Watch and AR/VR glasses drive the demand for multi - layer flexible boards (8 - 12 layers).

Innovation in Automotive Electronics: Dual - screen or triple - screen smart cockpits require long - strip FPCs (length > 500mm) with a line width accuracy of ±10μm.

Miniaturization of Medical Devices: Implantable blood glucose meters and heart monitors use ultra - thin FPCs (thickness < 0.1mm).

3. Growth Forecast

Compound Annual Growth Rate (CAGR): 9.5% from 2024 - 2030.

Market Size in 2030: To exceed $30 billion.

Emerging Growth Points: The proportion of automotive FPCs will increase to 25% (only 15% in 2023).

4. Technological Trends

Rigid - Flexible Boards: A hybrid design of FPC and rigid PCB (such as Tesla's in - vehicle camera module).

Substitution of PI with LCP Materials: The bending performance of LCP (Liquid Crystal Polymer) FPCs is increased by 30%, making them suitable for high - frequency scenarios.

IV. Competitive Landscape and Manufacturer Strategies

V. Risks and Challenges

High - Frequency Boards

Material Costs: The price of Rogers laminates is more than 10 times that of FR4, restricting the adoption by small and medium - sized customers.

Technical Substitution: SiP packaging may reduce the usage of PCBs in the RF front - end.

HDI Boards

Equipment Investment: The cost of a single laser drilling machine exceeds $5 million, making it difficult for small and medium - sized manufacturers to keep up.

Environmental Pressure: The wastewater treatment cost of the copper electroplating process is increasing.

Flexible Boards

Reliability Verification: Automotive FPCs need to pass the AEC - Q100 certification, which takes up to 12 months.

Material Bottlenecks: The LCP material supply chain is monopolized by Japanese companies (such as Murata and Kuraray).

VI. Investment and Strategic Suggestions

For High - Frequency Board Manufacturers

Layout hydrocarbon/PTFE hybrid materials to reduce costs.

Collaborate with satellite communication manufacturers (such as SpaceX and Huawei) to develop customized solutions.

For HDI Board Manufacturers

Seize the AI server substrate market and cooperate with chip giants like

NVIDIA and AMD.Develop buried capacitor and resistor processes to improve integration.

For Flexible Board Manufacturers

Expand the application of FPCs in the automotive three - electric system (battery/motor/electronic control).

Invest in roll - to - roll (R2R) production lines to increase efficiency by 30%.

Conclusion

The three categories of high - frequency boards, HDI boards, and flexible boards will continue to lead the growth of the PCB industry. However, the technical thresholds and market competition are also escalating simultaneously. Enterprises need to focus on material innovation, process upgrading, and vertical integration to stand out in the niche market.

Data Sources: Prismark, IDC, company financial reports, and industry interviews.

 Author: Jack Wang