Global PCB Market Report PCBMASTER Takes You to Understand the Sectors with Surging Demand in 2025 and Typical Cases

Author: Jack Wang

In 2025, the global printed circuit board (PCB) market will witness coordinated growth across multiple sectors. Emerging fields such as AI servers, low - earth - orbit satellite communications, humanoid robots, and new energy energy storage systems (ESS) will be the core drivers of explosive demand. The following analyzes the technical requirements and market potential of each field through specific cases.

I. AI Servers: PCB Upgrades in the Race for Computing Power

1. Typical Cases

NVIDIA DGX H100 Server

PCB Requirements: Each server requires 8 HDI substrates with a line width/line spacing of 40/40μm. It adopts the mSAP process and high - speed, low - loss materials (such as Panasonic MEGTRON 7).

Market Size: In 2024, the global demand for PCBs in AI servers is expected to exceed $2.5 billion, accounting for 35% of the total server PCB market (IDC data).

AMD Instinct MI300X Accelerator Card

Technical Highlights: The PCB substrate integrates 3D through - silicon via (TSV) technology, increasing the wiring density by 50% and driving the demand for any - layer HDI (ELIC).

2. Supplier Opportunities

Suppliers of high - frequency and high - speed laminates (such as the Rogers RO4000 series) will see an increase in orders.

Sub - contract manufacturers with high - precision SMT (such as 01005 component placement) will benefit.

II. Low - Earth - Orbit Satellite Communications: The Space Race between SpaceX and Huawei

1. Typical Cases

SpaceX Starlink V2 Satellite

PCB Requirements: Each satellite is equipped with 12 high - frequency PCBs, using Rogers RO3003 material (Dk = 3.0±0.04) and supporting Ku/Ka dual - band communication.

Market Size: In 2024, the global PCB market for satellite communications will reach $920 million (predicted by Euroconsult).

Huawei's "Xingyao" Low - Earth - Orbit Satellite Plan

Technical Breakthrough: The PCB integrates a phased - array antenna feed network and realizes a multi - layer rigid - flexible combined design (line width accuracy ±5μm).

2. Supplier Opportunities

There will be a surge in demand for high - frequency laminates (such as Teflon) and radiation - resistant coating processes.

III. Humanoid Robots: The Hardware Revolution of Tesla Optimus and Fourier Intelligence

1. Typical Cases

Tesla Optimus Gen - 2

PCB Requirements: Each robot requires 20 flexible PCBs (FPCs) for joint sensors and motor control. The bending life exceeds 500,000 times, and the temperature resistance range is - 40°C to 125°C.

Market Size: In 2024, the PCB market for humanoid robots is expected to exceed $350 million (GGII data).

Fourier Intelligence GR - 1

Technical Highlights: It uses rigid - flexible boards for compact wiring. The main control board integrates 12 - layer HDI with a line width/line spacing of 55/55μm.

2. Supplier Opportunities

High - bend - resistant FPCs and miniaturized HDI boards will become the core growth points.

IV. New Energy Energy Storage Systems (ESS): The Energy Storage Competition between CATL and Tesla

1. Typical Cases

CATL "EnerC" Energy Storage Cabinet

PCB Requirements: The battery management system (BMS) uses 6 - layer thick copper plates (4oz), can withstand 1500V, and supports a voltage sampling accuracy of ±1mV.

Market Size: In 2024, the demand for PCBs in energy storage systems will reach $1.8 billion (predicted by Wood Mackenzie).

Tesla Megapack 2XL

1.Technical Breakthrough: The PCB integrates a silicon carbide (SiC) drive circuit, and the heat dissipation design uses a copper substrate + ceramic - filled material.

2. Supplier Opportunities

· Suppliers of high - voltage - resistant PCBs and high - thermal - conductivity metal substrates will benefit.

V. Smart Cars: NIO ET9 and BYD's "Heavenly Eye"

1. Typical Cases

NIO ET9's 900V High - Voltage Platform

PCB Requirements: The domain controller uses an 8 - layer HDI board, can withstand 3kV, and the board material is Isola I - Tera MT40 (Dk = 3.8, temperature resistance 150°C).

BYD's "Heavenly Eye" Intelligent Driving System

Technical Highlights: The lidar control board uses high - frequency Rogers 4350B material (Df = 0.0037) and supports 77GHz millimeter - wave signal transmission.

2. Market Data

In 2024, the market size of automotive PCBs will reach $10.5 billion, with the ADAS segment growing the fastest (CAGR 22%).

VI. Medical Electronics: Breakthroughs in Miniaturization and Implantable Devices

1. Typical Cases

Medtronic's New - Generation Pacemaker

PCB Requirements: It is a 4 - layer flexible board with a size of 8mm×8mm and a thickness of 0.15mm, and it can pass 100,000 bending tests.

Technical Barrier: Biocompatible gold plating (thickness ≥ 0.1μm).

Abbott's Wearable Blood Glucose Monitor

Innovative Design: The PCB integrates a flexible biosensor, uses a polyimide substrate, and is resistant to sweat corrosion.

2. Supplier Opportunities

There will be an increase in demand for ultra - thin FPCs and biocompatible surface treatment processes.

VII. Summary: The Top 5 Sectors with Explosive PCB Demand in 2024

Supplier Action Suggestions

Technical Focus: Invest in HDI/mSAP production lines and stockpile high - frequency materials (such as Rogers and Isola).

Certification Layout: Accelerate the acquisition of certifications such as IATF 16949 (automotive) and ISO 13485 (medical).

Customer Bonding: Collaborate with leading technology companies (such as NVIDIA and SpaceX) to develop customized solutions.

Data Sources: Prismark, IDC, Company Financial Reports, Industry Interviews

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Author: Jack Wang