Frequency Board Manufacturing Process:
An important process - Hole treatment: Plasma cleaning machine (Plasma)
Difficulties in Manufacturing High - Frequency Boards:
A. Copper Plating:
It is not easy for copper to deposit on the hole walls.
B. Solder Mask:
Control over the adhesion of the solder mask and the occurrence of blistering in the solder mask.
C. Machining:
Due to the characteristics of the board materials, special cutting tools and specific parameters need to be used.
D. Process:
Strict control should be exerted over each process to prevent defects such as scratches, pits, and dents on the board surface.